Six Sigma in a Semiconductor Company

被引:0
|
作者
Riding, Karen D. [1 ]
Bruedern, Dirk-Alexander [1 ]
机构
[1] GLOBALFOUNDRIES, Corp Mfg Ctr Excellence, Malta, NY 12533 USA
来源
2014 25TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC) | 2014年
关键词
Six Sigma; semiconductor; Lean; Lean Six Sigma (L65); quality; Define-Measure-Analyze-Improve-Control (DMAIC); Design for Six Sigma (DFSS); Measurement System Analysis (MSA); Cause and Effect Diagram (Fishbone); Failure Modes and Effects Analysis (FMEA); Analysis of Variance (ANOVA); Design of Experiments (DOE); SIPOC (Supplier-Input-Process-Output-Customer);
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Lean and Six Sigma have been practiced by many companies over the last 15 years. Lean and Six Sigma are used to deliver breakthrough improvements in the business processes of a company, not incremental improvements. Lean and Six Sigma deployments are only successful if management in a company support, drive and buy-in to this approach to address business concerns. In this article, the methods, learnings and challenges will be described with the deployment of Lean Six Sigma in a ramping semiconductor company.
引用
收藏
页码:230 / 235
页数:6
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