Thermal Pressure Coefficient of a Polyhedral Oligomeric Silsesquioxane (POSS)-Reinforced Epoxy Resin

被引：7

作者：

Win, K. Z. ^{[1
]}

Karim, Taskin ^{[1
]}

Li, Qingxiu ^{[1
]}

Simon, Sindee L. ^{[1
]}

McKenna, Gregory B. ^{[1
]}

机构：

[1] Texas Tech Univ, Dept Chem Engn, Lubbock, TX 79409 USA

来源：

JOURNAL OF APPLIED POLYMER SCIENCE | 2010年 / 116卷 / 01期

基金：

美国国家航空航天局;

关键词：

nanocomposites; residual stress; thermal pressure coefficient; POSS; thermoset; epoxy; polymer; high-pressure vessel; GLASS-TRANSITION TEMPERATURE; ISOTROPIC RESIDUAL-STRESSES; TIME-DEPENDENT FAILURE; CURE; POLYMERS; SYSTEM;

D O I：

10.1002/app.31502

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

The thermal presssure coefficients of a neat, unfilled, epoxy resin and a 10 wt % POSS (polyhedral oligomeric silsesquioxane)-filled epoxy nanocomposite have been measured Using a thick-walled tube method. It is found that just below the glass transition temperature the thermal pressure coefficient is similar to 20%, smaller for the polymer composite containing 10% POSS than for the neat, unfilled resin. The thermal expansion coefficient and thermal pressure coefficient of the uncured POSS itself are also reported. (C) 2009 Wiley Periodicals, Inc. J Appl Polym Sci 116:142-146, 2010

引用

页码：142 / 146

页数：5

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