Diffusion Behavior of Zn During Reflow of Sn-9Zn Solder on Ni/Cu Substrate

被引：12

作者：

Mittal, Jagjiwan ^{[1
]}

Kuo, Shih-Ming ^{[1
]}

Lin, Yu-Wei ^{[1
]}

Lin, Kwang-Lung ^{[1
]}

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2009年 / 38卷 / 12期

关键词：

Lead-free solders; Sn-Zn alloy; diffusion; EPMA; EDX; SN-ZN; INTERMETALLIC COMPOUNDS; INTERFACIAL REACTIONS; JOINT RELIABILITY; NI; CU; GROWTH; LAYER; AU/NI/CU; TIN;

D O I：

10.1007/s11664-009-0941-x

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Reflow behavior of Sn-Zn solder on Ni/Cu substrate was investigated in an infrared (IR) reflow furnace using different heating rates from 180 degrees C/min to 36 degrees C/min. Energy dispersive spectroscopy (EDX) studies of the reflowed samples showed increased diffusion of Zn from the solder to the intermetallic compound (IMC) layer with a decrease in heating rate. Higher interfacial activity and affinity of the Zn in the formation of the IMC with the lowering of the heating rate were further demonstrated by electron probe microanalyzer (EPMA) results. The Zn diffusion behavior was related to its higher reactivity and smaller size in comparison with Sn, phase separation during heating, and affinity of Zn to form Ni-Sn-Zn and Ni-Zn intermetallic compounds.

引用

页码：2436 / 2442

页数：7

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