Heterogeneous and Chiplet Integration Using Organic Interposer (CoWoS-R)

被引：8
作者：
Jeng, Shin-Puu [1 ]
Liu, Monsen [1 ]
机构：
[1] Taiwan Semicond Mfg Co Ltd, Hsinchu 30075, Taiwan
来源：
2022 INTERNATIONAL ELECTRON DEVICES MEETING, IEDM | 2022年
关键词：
D O I：
10.1109/IEDM45625.2022.10019517
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Interposer technology is successfully adopted for heterogeneous and chiplet integration because of its advantages in electrical performance, warpage control, yield and reliability. Organic interposer (CoWoS-R) technology is one of the most promising new integration interposer platforms, providing low RC interconnect with good signal isolation and design scalability. New integrated de-cap capacitors suppress the power domain noise and enhance the HBM3 signal integrity at high data rate.
引用
收藏
页数：4
相关论文
共 11 条
  • [1] Casper B., 2011, IEEE WMED
  • [2] eps, HETEROGENEOUS INTEGR
  • [3] Evers M., 2021, PROC IEEE HOT CHIPS, P1
  • [4] Organic Interposer CoWoS-R+ (plus) Technology
    Lin, M. L.
    Liu, M. S.
    Chen, H. W.
    Chen, S. M.
    Yew, M. C.
    Chen, C. S.
    Jeng, Shin-Puu
    [J]. IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 1 - 6
  • [5] Reliability Performance of Advanced Organic Interposer (CoWoS®-R) Packages
    Lin, Po-Yao
    Yew, M. C.
    Yeh, S. S.
    Chen, S. M.
    Lin, C. H.
    Chen, C. S.
    Hsieh, C. C.
    Lu, Y. J.
    Chuang, P. Y.
    Cheng, H. K.
    Jeng, Shin-Puu
    [J]. IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 723 - 728
  • [6] Multilayer RDL Interposer for Heterogeneous Device and Module Integration
    Lin, Yi-Hang
    Yew, M. C.
    Liu, M. S.
    Chen, S. M.
    Lai, T. M.
    Kavle, P. N.
    Lin, C. H.
    Fang, T. J.
    Chen, C. S.
    Yu, C. T.
    Lee, K. C.
    Hsu, C. K.
    Lin, P. Y.
    Hsu, F. C.
    Jeng, Shin-Puu
    [J]. 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019, : 931 - 936
  • [7] Advanced Packaging Technologies for Co-packaged Optics
    Lu, Mei-Ju
    Mu, Sin-Yuan
    Cheng, Chia-Sheng
    Chen, Jihan
    [J]. IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 38 - 42
  • [8] Fine-Grained DRAM: Energy-Efficient DRAM for Extreme Bandwidth Systems
    O'Connor, Mike
    Chatterjee, Niladrish
    Lee, Donghyuk
    Wilson, John
    Agrawal, Aditya
    Keckler, Stephen W.
    Dally, William J.
    [J]. 50TH ANNUAL IEEE/ACM INTERNATIONAL SYMPOSIUM ON MICROARCHITECTURE (MICRO), 2017, : 41 - 54
  • [9] Thraskias C. A, 2018, IEEE COMMUN SURV TUT
  • [10] tsmc 3DFabric, US
12