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- [41] Design of Highly Efficient Narrowband Class-E Microwave Power Amplifier with Inverter as Pre-Driver 2014 INTERNATIONAL CONFERENCE ON COMMUNICATIONS AND SIGNAL PROCESSING (ICCSP), 2014,
- [43] Co-design of a novel CMOS highly parallel, low-power, multi-chip neural network accelerator 2024 IEEE 33RD MICROELECTRONICS DESIGN & TEST SYMPOSIUM, MDTS 2024, 2024,
- [44] 3D-Aware Low Power High-level Resource Binding and Co-Design PROCEEDINGS OF THE 29TH ACM/IEEE INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN, ISLPED 2024, 2024,
- [45] Co-Design of a Ka-Band High-Gain Low-Noise Amplifier and Chip-on-Board Packaging 2019 IEEE MTT-S INTERNATIONAL WIRELESS SYMPOSIUM (IWS 2019), 2019,
- [47] Electronic Design Automation (EDA) Tools and Considerations for Electro-Thermo-Mechanical Co-Design of High Voltage Power Modules 2020 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), 2020, : 5046 - 5052
- [49] Novel Design of Highly-efficient Concurrent Dual-band GaN Doherty Power Amplifier Using Direct-Matching Impedance Transformers 2016 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2016,
- [50] Co-design and Signal-Power Integrity/EMI Co-analysis of a Switchable High-speed Inter-Chiplet Serial Link on an Active Interposer IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 1329 - 1336