Glass as a Substrate for High Density Electrical Interconnect

被引:0
|
作者
Cui, Xiaoyun [1 ]
Bhatt, Deepa [1 ]
Khoshnaw, Fuad [1 ]
Hutt, David A. [1 ]
Conway, Paul P. [1 ]
机构
[1] Loughborough Univ Technol, Wolfson Sch Mech & Mfg Engn, Loughborough LE11 3TU, Leics, England
来源
EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3 | 2008年
关键词
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The high volume production of substrates able to support high density interconnection is becoming increasingly difficult as the pitch of devices continues to decrease. An important issue is the alignment of microvias and pads which is made particularly challenging by the dimensional instability of traditional organic substrates. In this work, glass has been investigated as an alternative substrate material. Glass offers potential advantages including: electrical insulation, dimensional stability, thermal expansion similar to Si and optical transparency. This paper examines manufacturing processes for the preparation of substrates built up from 50 to 100 mu m thick glass sheets. Excimer laser machining was used to form microvias and tracks in the glass which were metallised using electroless plating methods. Using a photoresist layer during the laser machining process helped to reduce debris on the glass surface and could be used to direct the subsequent deposition of electroless copper or nickel such that circuit patterns could be created. Lamination of the thin glass sheets was investigated using direct glass to glass bonding and through the use of an intermediate layer. A method for the combination of these techniques to create multilayer substrates is proposed.
引用
收藏
页码:12 / 17
页数:6
相关论文
共 50 条
  • [31] Advanced High Density Interconnect Materials and Techniques
    Wei, J.
    Nai, S. M. L.
    Ang, X. F.
    Yung, K. P.
    2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 1203 - 1210
  • [32] High frequency, high density interconnect using AC coupling
    Franzon, P
    Kingon, A
    Mick, S
    Wilson, J
    Luo, L
    Chandrasakhar, K
    Xu, J
    Bonafede, S
    Huffman, A
    Statler, C
    LaBennett, R
    MATERIALS, INTEGRATION AND PACKAGING ISSUES FOR HIGH-FREQUENCY DEVICES, 2004, 783 : 165 - 169
  • [33] ELECTRICAL PERFORMANCE OF HIGH-SPEED INTERCONNECT SYSTEMS
    SCHEINFEIN, MR
    LIAO, JC
    PALUSINSKI, OA
    PRINCE, JL
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (03): : 303 - 309
  • [34] Embedded Multi-Die Interconnect Bridge (EMIB) - A High Density, High Bandwidth Packaging Interconnect
    Mahajan, Ravi
    Sankman, Robert
    Patel, Neha
    Kim, Dae-Woo
    Aygun, Kemal
    Qian, Zhiguo
    Mekonnen, Yidnekachew
    Salama, Islam
    Sharan, Sujit
    Iyengar, Deepti
    Mallik, Debendra
    2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 557 - 565
  • [35] Electrical performance of an organic, z-interconnect, flip-chip substrate
    Rowlands, Michael J.
    Das, Rabindra
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 346 - +
  • [36] BISTs for Post-Bond Test and Electrical Analysis of High Density 3D Interconnect defects
    Jani, Imed
    Lattard, Didier
    Vivet, Pascal
    Arnaud, Lucile
    Beigne, Edith
    2018 23RD IEEE EUROPEAN TEST SYMPOSIUM (ETS), 2018,
  • [37] High Density Interconnect Processes for Panel Level Packaging
    Ostmann, Andreas
    Schein, Friedrich-Leonhard
    Dietterle, Michael
    Kunz, Marc
    Lang, Klaus-Dieter
    2018 7TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2018,
  • [38] NEW POLYIMIDES FOR HIGH-DENSITY INTERCONNECT PACKAGING
    CRAIG, JD
    LAUTENBERGER, WJ
    PROCEEDING OF THE TECHNICAL PROGRAM OF NEPCON WEST 89, VOLS 1 AND 2, 1989, : 925 - 926
  • [39] Very high density interconnect elastomer chip sockets
    Norberg, G
    Dejanovic, S
    Hesselbom, H
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2006, 29 (02): : 202 - 210
  • [40] High density interconnect embedded magnetics for integrated power
    Roshen, Waseem A.
    Korman, Charlie S.
    Daum, Wolfgang
    IEEE TRANSACTIONS ON POWER ELECTRONICS, 2006, 21 (04) : 867 - 879