Intra-chip wireless interconnect for clock distribution implemented with integrated antennas, receivers, and transmitters

被引:223
作者
Floyd, BA [1 ]
Hung, CM [1 ]
O, KK [1 ]
机构
[1] Univ Florida, Dept Elect & Comp Engn, SiMICS Res Grp, Gainesville, FL 32611 USA
关键词
15; GHz; clock distribution; frequency divider; injection locking; integrated antenna; low noise amplifier (LNA); on-chip antenna; RF CMOS; voltage-controlled oscillator (VCO); wireless clock distribution; wireless interconnect; zigzag antenna;
D O I
10.1109/4.997846
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A wireless interconnect system which transmits and receives RF signals across a chip using integrated antennas, receivers, and transmitters is proposed and demonstrated. The transmitter consists of a voltage-controlled oscillator, an output amplifier, and an antenna, while the receiver consists of an antenna, a low-noise amplifier, a frequency divider, and buffers. Using a 0.18-mum CMOS technology, each of these individual circuits is demonstrated at 15 GHz. Wireless interconnection for clock distribution is then demonstrated in two stages. First, a wireless transmitter with integrated antenna generates and broadcasts a 15-GHz global clock signal across a 5.6-mm test chip, and this signal is detected using receiving antennas. Second, a wireless clock receiver with an integrated antenna detects a 15-GHz global clock signal supplied to an on-chip transmitting antenna located 5.6 nun away from the receiver, and generates a 1.875-GHz local clock signal. This is the first known demonstration of an on-chip clock transmitter with an integrated antenna and the second demonstration of a clock receiver with an integrated antenna, where the receiver's frequency and interconnection distance have approximately been doubled over previous results.
引用
收藏
页码:543 / 552
页数:10
相关论文
共 24 条
[1]   A STUDY OF LOCKING PHENOMENA IN OSCILLATORS [J].
ADLER, R .
PROCEEDINGS OF THE INSTITUTE OF RADIO ENGINEERS, 1946, 34 (06) :351-357
[2]  
Balanis C. A., 2005, ANTENNA THEORY
[3]  
Bohr MT, 1995, INTERNATIONAL ELECTRON DEVICES MEETING, 1995 - IEDM TECHNICAL DIGEST, P241, DOI 10.1109/IEDM.1995.499187
[4]   Functional high-speed characterization and modeling of a six-layer copper wiring structure and performance comparison with aluminum on-chip interconnections [J].
Deutsch, A ;
Harrer, H ;
Surovic, CW ;
Hellner, G ;
Edelstein, DC ;
Goldblatt, RD ;
Biery, GA ;
Greco, NA ;
Foster, DM ;
Crabbe, E ;
Su, LT ;
Coteus, PW .
INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST, 1998, :295-298
[5]  
FLOYD B, 2000, IEEE INT SOL STAT CI, P328
[6]   A 15-GHz wireless interconnect implemented in a 0.18-μm CMOS technology using integrated transmitters, receivers, and antennas [J].
Floyd, BA ;
Hung, CM ;
O, KK .
2001 SYMPOSIUM ON VLSI CIRCUITS, DIGEST OF TECHNICAL PAPERS, 2001, :155-158
[7]   A 900-MHz, 0.8-μm CMOS low noise amplifier with 1.2-dB noise figure [J].
Floyd, BA ;
Mehta, J ;
Gamero, C ;
O, KK .
PROCEEDINGS OF THE IEEE 1999 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 1999, :661-664
[8]  
Gonzalez G., 1997, Microwave transistor amplifiers: analysis and design, VSecond
[9]   Fully integrated 5.35-GHz CMOS VCOs and prescalers [J].
Hung, CM ;
Floyd, BA ;
Park, N ;
O, KK .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2001, 49 (01) :17-22
[10]   A packaged 1.1-GHz CMOS VCO with phase noise of-126 dBc/Hz at a 600-kHz offset [J].
Hung, CM ;
O, KK .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2000, 35 (01) :100-103