Deep etching of glass wafers using sputtered molybdenum masks

被引：29

作者：

Ceyssens, Frederik ^{[1
]}

Puers, Robert ^{[1
]}

机构：

[1] KULeuven, Dept ESAT MICAS, Kasteelpk Arenberg 10, Louvain, Belgium

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2009年 / 19卷 / 06期

关键词：

FABRICATION;

D O I：

10.1088/0960-1317/19/6/067001

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This note presents a simple, low-cost technology to fabricate very deep isotropically etched features in glass wafers. A process based on fast etching glass combined with a stress-optimized molybdenum mask layer and a photoresist was found to be very suitable for such purposes. The obtained performance, up to 1.2 mm deep etching, rivals the best existing techniques while being more cost-competitive and using widely available equipment.

引用

页数：6

共 19 条

[1] Characterization of masking materials for deep glass micromachining [J].

Bien, DCS ;

Rainey, PV ;

Mitchell, SJN ;

Gamble, HS .

JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2003, 13 (04) :S34-S40

[2] A new masking technology for deep glass etching and its microfluidic application [J].

Bu, MQ ;

Melvin, T ;

Ensell, GJ ;

Wilkinson, JS ;

Evans, AGR .

SENSORS AND ACTUATORS A-PHYSICAL, 2004, 115 (2-3) :476-482

[3] Deep wet etching of borosilicate glass using an anodically bonded silicon substrate as mask [J].

Corman, T ;

Enoksson, P ;

Stemme, G .

JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 1998, 8 (02) :84-87

[4] A new fabrication method for borosilicate glass capillary tubes with lateral inlets and outlets [J].

Gretillat, MA ;

Paoletti, F ;

Thiebaud, P ;

Roth, S ;

KoudelkaHep, M ;

deRooij, NF .

SENSORS AND ACTUATORS A-PHYSICAL, 1997, 60 (1-3) :219-222

[5]

Harper C.A., 2003, Electronic materials and processes handbook, V3rd

[6] Optimization of an amorphous silicon mask PECVD process for deep wet etching of Pyrex glass [J].

Iliescu, C ;

Miao, JM ;

Tay, FEH .

SURFACE & COATINGS TECHNOLOGY, 2005, 192 (01) :43-47

[7] Stress control in masking layers for deep wet micromachining of Pyrex glass [J].

Iliescu, C ;

Miao, JM ;

Tay, FEH .

SENSORS AND ACTUATORS A-PHYSICAL, 2005, 117 (02) :286-292

[8]

Iliescu C, 2007, PROC IEEE MICR ELECT, P762

[9] On the wet etching of Pyrex glass [J].

Iliescu, Ciprian ;

Chen, Bangtao ;

Miao, Jianmin .

SENSORS AND ACTUATORS A-PHYSICAL, 2008, 143 (01) :154-161

[10] Deep reactive ion etching of Pyrex glass using SF6 plasma [J].

Li, XH ;

Abe, T ;

Esashi, M .

SENSORS AND ACTUATORS A-PHYSICAL, 2001, 87 (03) :139-145

← 1 2 →