Dynamic compact thermal model of high power light emitting diode

被引：1

作者：

Lai, Wei ^{[1
]}

Liu, Xianming ^{[1
]}

Chen, Weimin ^{[1
]}

Lei, Xiaohua ^{[1
]}

Cao, Xueying ^{[1
]}

机构：

[1] Chongqing Univ, Coll Optoelect Engn, Minist Educ, Key Lab Optoelect Technol & Syst, Chongqing 400044, Peoples R China

来源：

MICROELECTRONICS RELIABILITY | 2015年 / 55卷 / 12期

关键词：

Dynamic compact thermal model; Time constant spectra; Thermal resistance; Light emitting diode; DIE ATTACH; TRANSIENT; PERFORMANCE; RESISTANCE;

D O I：

10.1016/j.microrel.2015.10.001

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Dynamic compact thermal model plays important roles in predicting the junction temperature and characterizing the transient thermal behavior of an electronic device. In this paper, analytical dynamic compact thermal model for high power LEDs is established based on the three-directional heat flow paths under junction-to-ambient definition. Comparative results with finite element method model indicate that the presented model is accurate and efficient. It is further reduced by analyzing the influence of different components of the LED package. Good agreement with experimental results confirms that the reduced analytical model can predict the junction temperature and characterize the thermal behavior effectively. (C) 2015 Elsevier Ltd. All rights reserved.

引用

页码：2663 / 2670

页数：8

共 28 条

[1]

[Anonymous], 1995, JESD512 EL IND ALL

[2]

[Anonymous], 1995, JESD511 EL IND ALL

[3] Innovative methodology to extract dynamic compact thermal models: Application to power devices [J].

Azoui, Toufik ;

Tounsi, Patrick ;

Dorkel, Jean-Marie .

MICROELECTRONICS JOURNAL, 2012, 43 (09) :642-648

[4] The performance of compact thermal models for LED package [J].

Chen, Huanting ;

Lu, Yijun ;

Gao, Yulin ;

Zhang, Haibing ;

Chen, Zhong .

THERMOCHIMICA ACTA, 2009, 488 (1-2) :33-38

[5] Automated Fast Extraction of Compact Thermal Models for Power Electronic Modules [J].

Evans, Paul L. ;

Castellazzi, Alberto ;

Johnson, C. Mark .

IEEE TRANSACTIONS ON POWER ELECTRONICS, 2013, 28 (10) :4791-4802

[6] Application of network identification by deconvolution method to the thermal analysis of the pump-probe transient thermoreflectance signal [J].

Ezzahri, Y. ;

Shakouri, A. .

REVIEW OF SCIENTIFIC INSTRUMENTS, 2009, 80 (07)

[7] Thermal impedance spectroscopy of power modules [J].

Hensler, A. ;

Wingert, D. ;

Herold, Ch. ;

Lutz, J. ;

Thoben, M. .

MICROELECTRONICS RELIABILITY, 2011, 51 (9-11) :1679-1683

[8] System dynamics model of high-power LED luminaire [J].

Huang, Bin-Juine ;

Tang, Chun-Wen ;

Wu, Min-Sheng .

APPLIED THERMAL ENGINEERING, 2009, 29 (04) :609-616

[9] Generation of reduced dynamic thermal models of electronic systems from time constant spectra of transient temperature responses [J].

Janicki, Marcin ;

Banaszczyk, Jedrzej ;

Vermeersch, Bjorn ;

De Mey, Gilbert ;

Napieralski, Andrzej .

MICROELECTRONICS RELIABILITY, 2011, 51 (08) :1351-1355

[10] Dynamic thermal modelling of a power integrated circuit with the application of structure functions [J].

Janicki, Marcin ;

Banaszczyk, Jedrzej ;

De Mey, Gilbert ;

Kaminski, Marek ;

Vermeersch, Bjorn ;

Napieralski, Andrzej .

MICROELECTRONICS JOURNAL, 2009, 40 (07) :1135-1140

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