On the relation between damage rate and stress level evolution in α-Cr2O3 thin films growing on Ni-33at%Cr

被引:14
作者
Siab, R. [2 ]
Huvier, C. [1 ]
Kemdehoundja, M. [1 ]
Grosseau-Poussard, J. L. [1 ]
Dinhut, J. F. [1 ]
机构
[1] Univ La Rochelle, LEMMA, F-17042 La Rochelle, France
[2] Ctr Univ El Tarf, El Tarf 36000, Algeria
关键词
Oxidation; Effects of strain; Stress relaxation; HIGH-TEMPERATURE OXIDATION; ALUMINA;
D O I
10.1016/j.corsci.2009.05.032
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The blistering phenomenon has been studied in chromia films formed between 700 and 900 degrees C on Ni33at%Cr. The experimental conditions of the blister occurrence and the damaged surface by blisters and spalls have been determined. From the comparison between the growth stress evolution in the oxide film - which has been related to the oxide microstructure development - and the damage rate the stress relaxation by creep is shown to prevent the formation of blisters and spalls. (C) 2009 Elsevier Ltd. All rights reserved.
引用
收藏
页码:2246 / 2248
页数:3
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