Effects of Cu Content on Microstructure and High-Temperature Oxidation Behavior of Ti-Al-Si-Cu-N Nanocomposite Films

被引：0
作者：
Feng Changjie [1 ]
Chen En [1 ]
Li Mingsheng [2 ]
Wu Namei [1 ]
机构：
[1] Nanchang Hangkong Univ, Nanchang 330063, Jiangxi, Peoples R China
[2] Jiangxi Sci & Technol Normal Univ, Jiangxi Key Lab Surface Engn, Nanchang 330013, Jiangxi, Peoples R China
来源：
RARE METAL MATERIALS AND ENGINEERING | 2017年 / 46卷 / 03期
基金：
中国国家自然科学基金;
关键词：
reactive magnetron sputtering; Ti-Al-Si-Cu-N films; microstructure; high temperature oxidation resistance; TITANIUM NITRIDE; THIN-FILMS; COATINGS; RESISTANCE; SILICON;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Ti-Al-Si-Cu-N nanocomposite films with different Cu contents were deposited on AISI-304 stainless steel by DC reactive magnetron sputtering. Both Ti-Al-Si-N and Ti-Al-Si-Cu-N nanocomposite films were oxidized at 800 degrees C to investigate the influence of Cu content on the microstructure and high temperature oxidation resistance by scanning electron microscope (SEM), energy disperse spectroscopy (EDS), X-ray diffraction (XRD), nanoindentation tester and a home-made indentation system. The results indicate that with the increasing copper content in the films, the micropores disappear on the surface of Ti-Al-Si-N nanocomposite film and compact films are obtained. A reduction of the grain size and a change of the (111) preferred orientation to (110) are observed. The microhardness of films increases from 14.76 GPa to 19.42 GPa. The elasticity modulus of Ti-Al-Si-Cu-N films with 1.72 at% Cu content is the minimum of 104.5 GPa. The incorporation of copper at high temperature influences the oxidation resistance of the Ti-Al-Si-N films in the two aspects, one is advancing the diffusion rate of Al element, and the other is inducing cracks of oxide layer and micropores. Ti-Al-Si-N films have a better oxidation resistance than that of the films added Cu element.
引用
收藏
页码：627 / 633
页数：7
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