Fabrication of Linear Array and Top-Orthogonal-to-Bottom Electrode CMUT Arrays With a Sacrificial Release Process

被引：28

作者：

Greenlay, Benjamin A. ^{[1
]}

Zemp, Roger J. ^{[1
]}

机构：

[1] Univ Alberta, Dept Elect & Comp Engn, Edmonton, AB T6G2R3, Canada

来源：

IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL | 2017年 / 64卷 / 01期

基金：

加拿大自然科学与工程研究理事会;

关键词：

Capacitive micromachined ultrasound transducers (CMUT); microelectromechanical systems; microfabrication; process flow; sacrificial release; yield factors; MICROMACHINED ULTRASONIC TRANSDUCERS; CIRCUIT MODEL; INTEGRATION; PLATES; CELL;

D O I：

10.1109/TUFFC.2016.2620425

中图分类号：

O42 [声学];

学科分类号：

070206 ; 082403 ;

摘要：

The microfabrication processes for sacrificial-release-based capacitive micromachined ultrasound transducer arrays are provided with an emphasis on top-orthogonal-to-bottom electrode 2-D arrays. These arrays have significant promise for high-quality 3-D imaging with reduced wiring complexity compared with fully wired arrays. The protocols and best practices are outlined in significant detail along with design considerations and notes of caution for pitfalls and factors impacting yield.

引用

页码：93 / 107

页数：15

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