Method for Mitigating Electrochemical Migration on Printed Circuit Boards

被引：4
作者：
Hong, Min-Sung [1 ]
Kim, Jung-Gu [1 ]
机构：
[1] Sungkyunkwan Univ, Sch Adv Mat Sci & Engn, 300 Chunchun Dong, Suwon 440746, South Korea
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2019年 / 48卷 / 08期
基金：
新加坡国家研究基金会;
关键词：
Metal; electrochemical migration; oxygen scavenger; water drop test; electrochemical test; RELIABILITY; TIN;
D O I：
10.1007/s11664-019-07300-9
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
An effective method for preventing electrochemical migration (ECM) by adding carbohydrazide as an oxygen scavenger has been investigated on FR-4 printed circuit boards with Cu or Ag comb patterns by means of water drop testing, electrochemical testing, and surface analysis. The addition of carbohydrazide increased the mean time to failure by ECM in solutions with both low and high chloride concentrations, by delaying the formation and growth of dendrites. Also, the carbohydrazide decreased the kinetics of the oxygen reduction reaction evident in polarization curves. Thus, carbohydrazide retarded the ECM phenomenon by removing oxygen from solution, which suppressed the formation of dendrites.
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页码：5012 / 5017
页数：6
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