Imaging and dopant profiling of silicon carbide devices by secondary electron dopant contrast

被引:11
作者
Buzzo, Marco [1 ]
Ciappa, Mauro
Fichtner, Wolfgang
机构
[1] Swiss Fed Inst Technol, Integrated Syst Lab, CH-8092 Zurich, Switzerland
[2] Infineon Technol, A-9500 Vilach, Austria
关键词
secondary electron dopant contrast (SEDC); silicon carbide (SiC); two-dimensional (2-D) dopant profiling;
D O I
10.1109/TDMR.2006.876605
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, the secondary electron dopant contrast in scanning electron microscopy is proposed as the method of choice for dopant-imaging and profiling in silicon carbide devices. After reviewing the physical principles of the signal generation, the impact on the image quality of relevant factors such as experimental conditions, surface effects, and sample preparation is investigated. The quantitative capabilities of this technique are compared with the performance of the most advanced scanning probe methods. Particular attention is devoted to the quantitative delineation of electrical junctions and the two-dimensional dopant profiling of complex structures.
引用
收藏
页码:203 / 212
页数:10
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