Online Junction Temperature Measurement Using Peak Gate Current

被引:0
作者
Baker, Nick [1 ]
Munk-Nielsen, Stig [1 ]
Iannuzzo, Francesco [1 ]
Liserre, Marco [2 ]
机构
[1] Aalborg Univ, Dept Energy Technol, Aalborg, Denmark
[2] Univ Kiel, Chair Power Elect, Kiel, Germany
来源
2015 THIRTIETH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2015) | 2015年
关键词
Junction Temperature; IGBT; MOSFET; Measurement; Reliability; Power Semiconductors; POWER; MODULES; DEVICES;
D O I
暂无
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
A new method for junction temperature measurement of MOS-gated power semiconductor switches is presented. The measurement method involves detecting the peak voltage over the external gate resistor of an IGBT or MOSFET during turn-on. This voltage is directly proportional to the peak gate current and fluctuates with temperature due to the temperature-dependent resistance of the internal gate resistance. A measurement circuit can be integrated into a gate driver with no disruption to converter operation. The method is immune to dependence on load current, and allows autonomous and high frequency measurements through a measurement circuit directly controlled via the gate signal.
引用
收藏
页码:1270 / 1275
页数:6
相关论文
共 14 条
[1]   Choosing a thermal model for electrothermal simulation of power semiconductor devices [J].
Ammous, A ;
Ghedira, S ;
Allard, B ;
Morel, H ;
Renault, D .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 1999, 14 (02) :300-307
[2]  
[Anonymous], 2002, Proc. PCIM PE4. 5, P59
[3]   Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters-A Review [J].
Avenas, Yvan ;
Dupont, Laurent ;
Khatir, Zoubir .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2012, 27 (06) :3081-3092
[4]   Improved Reliability of Power Modules A Review of Online Junction Temperature Measurement Methods [J].
Baker, Nick ;
Liserre, Marco ;
Dupont, Laurent ;
Avenas, Yvan .
IEEE INDUSTRIAL ELECTRONICS MAGAZINE, 2014, 8 (03) :17-27
[5]  
Baliga J., 1996, POWER SEMICONDUCTOR
[6]  
Blackburn D. L., 1988, Fourth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (Cat. No.88CH2530-4), P1, DOI 10.1109/SEMTHE.1988.10589
[7]   Temperature measurements of semiconductor devices - A review [J].
Blackburn, DL .
TWENTIETH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2004, 2004, :70-80
[8]  
Brekel W., 2009, P PCIM EUR NUR GERM, P806
[9]  
Denkowski M., 2014, P PCIM EUR 2014 INT, P1
[10]  
Hoene E., 2013, Patent, Patent No. [WO2013000971, 2013000971]