Liquid cooling module using FC-72 for electronics cooling

A liquid cooling module as a cooling means for electronic devices using boiling and condensation heat transfer was designed and its performance was investigated, The liquid cooling module was comprised of a boiling plate, spacer, and condenser plate and used FC-72 as the working fluid. The size of the module was 101 mm x 108 min x 18 mm and the chip size (heat source) used was 10 nun x 10 mm. To enhance boiling performance, pin fins combined with the microporous coating technique were used on the boiling plate surface. Heat rejection from the module was achieved using two different methods; a water-cooled cold plate and an air-cooled heat sink/fan assembly. In addition to experimental testing, an empirically based performance prediction method was also developed. Using the water-cooled cold plate and a chip temperature constraint of 100 degrees C, the cooling module was capable of dissipating heat fluxes of 1850 and 2100 kW/m(2) for cold plate water inlet temperatures of 35 and 20 degrees C, respectively. In addition, the total thermal resistance for the 35 degrees C inlet case was calculated to be 0.355 K/W. Use of the microporous coating on the boiling section improved heat transfer by about 31%. Using the air-cooled heat sink/fan assembly and the same chip temperature constraint of 100 degrees C, the cooling module was capable of dissipating a heat flux of 2200 kW/m(2) and exhibited a total thermal resistance of 0.349 K/W with an ambient air temperature of 22 degrees C.