Low-Temperature Sintering Characteristics of Ag-Based Complex Inks Using Transient Melting and Joining of Sn-58Bi Nanoparticles

被引：1

作者：

Choi, Woo Lim ^{[1
]}

Lee, Jong-Hyun ^{[1
]}

机构：

[1] Seoul Natl Univ Sci & Technol, Dept Mat Sci & Engn, Seoul 01811, South Korea

来源：

METALS AND MATERIALS INTERNATIONAL | 2019年 / 25卷 / 05期

关键词：

Sintering; Electrical resistivity; Thin films; Nanostructure; Complex ink; PRINTED SILVER TRACKS; FABRICATION;

D O I：

10.1007/s12540-019-00293-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A novel complex ink was fabricated by mixing Sn-58Bi nanoparticles with a commercial conductive ink containing Ag nanoparticles and then sintered rapidly for 110s at 140 degrees C in air using a conveyor-type reflow furnace. Sn-58Bi nanoparticles smaller than 15nm wetted on the neighboring Ag nanoparticles immediately after melting at temperatures lower than their melting point, and hence, acted as transient liquid-phase binders. The composite film sintered with 4wt% Sn-58Bi exhibited stability and a low electrical resistivity of 4.46 mu Omega cm, and hence, was found to be compatible with low-cost flexible films. [GRAPHICS] .

引用

页码：1388 / 1393

页数：6