Low-Temperature Sintering Characteristics of Ag-Based Complex Inks Using Transient Melting and Joining of Sn-58Bi Nanoparticles

被引：1
作者：
Choi, Woo Lim [1 ]
Lee, Jong-Hyun [1 ]
机构：
[1] Seoul Natl Univ Sci & Technol, Dept Mat Sci & Engn, Seoul 01811, South Korea
来源：
METALS AND MATERIALS INTERNATIONAL | 2019年 / 25卷 / 05期
关键词：
Sintering; Electrical resistivity; Thin films; Nanostructure; Complex ink; PRINTED SILVER TRACKS; FABRICATION;
D O I：
10.1007/s12540-019-00293-4
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A novel complex ink was fabricated by mixing Sn-58Bi nanoparticles with a commercial conductive ink containing Ag nanoparticles and then sintered rapidly for 110s at 140 degrees C in air using a conveyor-type reflow furnace. Sn-58Bi nanoparticles smaller than 15nm wetted on the neighboring Ag nanoparticles immediately after melting at temperatures lower than their melting point, and hence, acted as transient liquid-phase binders. The composite film sintered with 4wt% Sn-58Bi exhibited stability and a low electrical resistivity of 4.46 mu Omega cm, and hence, was found to be compatible with low-cost flexible films. [GRAPHICS] .
引用
收藏
页码：1388 / 1393
页数：6
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