Low-Temperature Sintering Characteristics of Ag-Based Complex Inks Using Transient Melting and Joining of Sn-58Bi Nanoparticles

被引：1
作者：
Choi, Woo Lim [1 ]
Lee, Jong-Hyun [1 ]
机构：
[1] Seoul Natl Univ Sci & Technol, Dept Mat Sci & Engn, Seoul 01811, South Korea
来源：
METALS AND MATERIALS INTERNATIONAL | 2019年 / 25卷 / 05期
关键词：
Sintering; Electrical resistivity; Thin films; Nanostructure; Complex ink; PRINTED SILVER TRACKS; FABRICATION;
D O I：
10.1007/s12540-019-00293-4
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A novel complex ink was fabricated by mixing Sn-58Bi nanoparticles with a commercial conductive ink containing Ag nanoparticles and then sintered rapidly for 110s at 140 degrees C in air using a conveyor-type reflow furnace. Sn-58Bi nanoparticles smaller than 15nm wetted on the neighboring Ag nanoparticles immediately after melting at temperatures lower than their melting point, and hence, acted as transient liquid-phase binders. The composite film sintered with 4wt% Sn-58Bi exhibited stability and a low electrical resistivity of 4.46 mu Omega cm, and hence, was found to be compatible with low-cost flexible films. [GRAPHICS] .
引用
收藏
页码：1388 / 1393
页数：6
相关论文
共 22 条
  • [1] Ink-jet printing, self-assembled polyelectrolytes, and electroless plating: Low cost fabrication of circuits on a flexible substrate at room temperature
    Cheng, K
    Yang, MH
    Chiu, WWW
    Huang, CY
    Chang, J
    Ying, TF
    Yang, Y
    [J]. MACROMOLECULAR RAPID COMMUNICATIONS, 2005, 26 (04) : 247 - 264
  • [2] Synthesis and melting behaviour of Bi, Sn and Sn-Bi nanostructured alloy
    Frongia, F.
    Pilloni, M.
    Scano, A.
    Ardu, A.
    Cannas, C.
    Musinu, A.
    Borzone, G.
    Delsante, S.
    Novakovic, R.
    Ennas, G.
    [J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2015, 623 : 7 - 14
  • [3] Direct ink-jet printing of Ag-Cu nanoparticle and Ag-precursor based electrodes for OFET applications
    Gamerith, Stefan
    Klug, Andreas
    Scheiber, Horst
    Scherf, Ullrich
    Moderegger, Erik
    List, Emit J. W.
    [J]. ADVANCED FUNCTIONAL MATERIALS, 2007, 17 (16) : 3111 - 3118
  • [4] Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy
    Gao, Yulai
    Zou, Changdong
    Yang, Bin
    Zhai, Qijie
    Liu, Johan
    Zhuravlev, Evgeny
    Schick, Christoph
    [J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 484 (1-2) : 777 - 781
  • [5] Investigation on synchronization of the offset printing process for fine patterning and precision overlay
    Kang, Dongwoo
    Lee, Eonseok
    Kim, Hyunchang
    Choi, Young-Man
    Lee, Seunghyun
    Kim, Inyoung
    Yoon, Dukkyun
    Jo, Jeongdai
    Kim, Bongmin
    Lee, Taik-Min
    [J]. JOURNAL OF APPLIED PHYSICS, 2014, 115 (23)
  • [6] DENSIFICATION DURING SINTERING IN THE PRESENCE OF A LIQUID PHASE .1. THEORY
    KINGERY, WD
    [J]. JOURNAL OF APPLIED PHYSICS, 1959, 30 (03) : 301 - 306
  • [7] Synthesis of silver nano particles and fabrication of aqueous Ag inks for inkjet printing
    Kosmala, A.
    Wright, R.
    Zhang, Q.
    Kirby, A.
    [J]. MATERIALS CHEMISTRY AND PHYSICS, 2011, 129 (03) : 1075 - 1080
  • [8] Performance of printable supercapacitors in an RF energy harvesting circuit
    Lehtimaki, Suvi
    Li, Miao
    Salomaa, Jarno
    Porhonen, Juho
    Kalanti, Antti
    Tuukkanen, Sampo
    Heljo, Petri
    Halonen, Kari
    Lupo, Donald
    [J]. INTERNATIONAL JOURNAL OF ELECTRICAL POWER & ENERGY SYSTEMS, 2014, 58 : 42 - 46
  • [9] Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area (> 100 mm2) Chips
    Lei, Thomas Guangyin
    Calata, Jesus Noel
    Lu, Guo-Quan
    Chen, Xu
    Luo, Shufang
    [J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2010, 33 (01): : 98 - 104
  • [10] Triggering the Sintering of Silver Nanoparticles at Room Temperature
    Magdassi, Shlomo
    Grouchko, Michael
    Berezin, Oleg
    Kamyshny, Alexander
    [J]. ACS NANO, 2010, 4 (04) : 1943 - 1948
123