Preparation and Thermal Conductivity of Nickel Fiber (Powder)/Silicone Rubber Composites Induced by Magnetic Field

被引:6
作者
Xie, Dongsheng [1 ]
Meng, Xianfeng [1 ]
Ma, Jie [1 ]
Zhu, Lin [1 ]
Shen, Xiangqian [1 ]
机构
[1] Jiangsu Univ, Sch Mat Sci & Engn, Zhenjiang 212013, Peoples R China
关键词
Silicone rubber; Nickel fiber; Nickel powder; Composite; Thermal conductivity; BORON-NITRIDE; ENHANCEMENT; PARTICLES;
D O I
10.1177/096739111402200504
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Silicone rubber composites filled with Ni powder (fiber) were successfully prepared, and the effect of fillers and magnetic field on the thermal conductivity of composite was investigated. The results showed that with the increasing of volume content of fillers, the thermal conductivity of composite increases. The Maxwell model and Cheng-Vachon equation were used to predict the thermal conductivity to explain the effect of Ni powder (fiber) fillers on the formation of thermal conductive networks. The SEM results indicated that aligned linetypelike structure had formed under magnetic field. Therefore, the presence of magnetic field during curing process could significantly enhance the thermal conductivity of composite.
引用
收藏
页码:453 / 457
页数:5
相关论文
共 18 条
[1]   Modification of BN nanosheets and their thermal conducting properties in nanocomposite film with polysiloxane according to the orientation of BN [J].
Cho, Hong-Baek ;
Tokoi, Yoshinori ;
Tanaka, Satoshi ;
Suematsu, Hisayuki ;
Suzuki, Tsuneo ;
Jiang, Weihua ;
Niihara, Koichi ;
Nakayama, Tadachika .
COMPOSITES SCIENCE AND TECHNOLOGY, 2011, 71 (08) :1046-1052
[2]   Enhancement of thermal and electrical properties of carbon nanotube polymer composites by magnetic field processing [J].
Choi, ES ;
Brooks, JS ;
Eaton, DL ;
Al-Haik, MS ;
Hussaini, MY ;
Garmestani, H ;
Li, D ;
Dahmen, K .
JOURNAL OF APPLIED PHYSICS, 2003, 94 (09) :6034-6039
[3]   Flow-induced transition from cylindrical to layered patterns in magnetorheological suspensions [J].
Cutillas, S ;
Bossis, G ;
Cebers, A .
PHYSICAL REVIEW E, 1998, 57 (01) :804-811
[4]   Percolation theory applied to the analysis of thermal interface materials in flip-chip technology [J].
Devpura, A ;
Phelan, PE ;
Prasher, RS .
ITHERM 2000: SEVENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOL I, PROCEEDINGS, 2000, :21-28
[5]   Nickel and iron nano-particles in natural rubber composites [J].
El-Nashar, D. E. ;
Mansour, S. H. ;
Girgis, E. .
JOURNAL OF MATERIALS SCIENCE, 2006, 41 (16) :5359-5364
[6]   Thermal conductivity enhancement of BN/silicone composites cured under electric field: Stacking of shape, thermal conductivity, and particle packing structure anisotropies [J].
Han, Yuwang ;
Lv, Sumin ;
Hao, Chanxi ;
Ding, Fei ;
Zhang, Yi .
THERMOCHIMICA ACTA, 2012, 529 :68-73
[7]   Thermal characterization of an epoxy-based underfill material for flip chip packaging [J].
He, Y ;
Moreira, BE ;
Overson, A ;
Nakamura, SH ;
Bider, C ;
Briscoe, JF .
THERMOCHIMICA ACTA, 2000, 357 :1-8
[8]   Cold plasma modification of boron nitride fillers and its effect on the thermal conductivity of silicone rubber/boron nitride composites [J].
Ji, Tuo ;
Zhang, Li-Qun ;
Wang, Wen-Cai ;
Liu, Yu ;
Zhang, Xiao-Feng ;
Lu, Yong-Lai .
POLYMER COMPOSITES, 2012, 33 (09) :1473-1481
[9]   Preparation, Microstructure, and Property of Silicon Rubber/Organically Modified Montmorillonite Nanocomposites and Silicon Rubber/OMMT/Fumed Silica Ternary Nanocomposites [J].
Jia, Chao ;
Zhang, Li-Qun ;
Zhang, Hao ;
Lu, Yong-Lai .
POLYMER COMPOSITES, 2011, 32 (08) :1245-1253
[10]   Properties of thermally conductive micro and nano size boron nitride reinforced silicon rubber composites [J].
Kemaloglu, Sebnem ;
Ozkoc, Guralp ;
Aytac, Ayse .
THERMOCHIMICA ACTA, 2010, 499 (1-2) :40-47