MEMS based vacuum packaging method of optically readable infrared focal plane array

被引:1
作者
Feng, Fei [1 ]
Zhang, Yunsheng [1 ]
Luo, Fan [1 ]
Wei, Xudong [1 ]
Ge, Xiaohong [1 ]
Wang, Yuelin [1 ]
Li, Xinxin [1 ]
机构
[1] Chinese Acad Sci, State Key Lab Transducer Technol, Shanghai Inst Microsyst & Informat Technol, Shanghai, Peoples R China
来源
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 2017年 / 23卷 / 06期
基金
中国国家自然科学基金; 国家高技术研究发展计划(863计划);
关键词
Infrared Image; Micrometer Scale; Optical Window; Vacuum Packaging; Infrared Signal;
D O I
10.1007/s00542-016-3036-7
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A MEMS based vacuum packaging method is developed for uncooled optically readable infrared focal plane array (OR-IRFPA). The vacuum packaging structure is made up of three layers: a glass visible window, a silicon spacer, and a silicon infrared window. The silicon spacer is bonded with the glass visible window to form two cavities: one cavity for getter and another one for OR-IRFPA. The isolation wall with micrometer scale pores is designed to ensure air's free flow between two cavities and prevent getter powder from harming pixels of OR-IRFPA. The infrared window is used as cover board and selectively transmitting 8-14 mu m infrared radiation. Infrared images of human body are gotten by using the vacuum packaged OR-IRFPA, which shows the vacuum packaging method is feasible and useful for OR-IRFPA.
引用
收藏
页码:1793 / 1798
页数:6
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