A High-level Signal Integrity Fault Model and Test Methodology for Long On-Chip Interconnections

被引：0

作者：

Chun, Sunghoon ^{[1
]}

Kim, Yongjoon ^{[1
]}

Kim, Taejin ^{[2
]}

Kang, Sungho ^{[1
]}

机构：

[1] Yonsei Univ, Dept Elect & Elect Engn, 134 Shinchon Dong, Seoul 120749, South Korea

[2] LIG Nexl Co, Avion R&D Lab, Daejeon, South Korea

来源：

2009 27TH IEEE VLSI TEST SYMPOSIUM, PROCEEDINGS | 2009年

关键词：

VERIFICATION;

D O I：

10.1109/VTS.2009.38

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

In this paper, considering the interconnection topology information, an abstract model and a new test pattern generation method of signal integrity problems on interconnects are proposed. In addition, previous SPICE-based pattern generation methods are too complex and time consuming to generate test patterns for signal integrity faults. To more accurately detect signal integrity defects on practical on-chip interconnection lines and avoid time consuming for interconnection analysis, in this paper, we propose a new high-level signal integrity fault model to estimate noise effects based on process variation and interconnect signal transition. Experimental results show that the proposed signal integrity fault model is more exact for long interconnects than previous approaches. In addition, the proposed method is much faster titan the SPICE-based pattern generation method.

引用

页码：152 / +

页数：2