Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes

被引：35

作者：

Chen, Hao ^{[1
]}

Tsai, Yi-Ling ^{[1
]}

Chang, Yu-Ting ^{[2
]}

Wu, Albert T. ^{[1
]}

机构：

[1] Natl Cent Univ, Dept Chem & Mat Engn, Taoyuan 320, Taiwan

[2] Taiwan Uyemura Ltd Co, Taoyuan 320, Taiwan

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2016年 / 671卷

关键词：

Massive spalling; Multiple reflows; Intermetallic compound; Shear test; SAC305; Co-Sn-P; INTERFACIAL REACTION; INTERMETALLIC COMPOUND; BUMP METALLIZATION; SHEAR-STRENGTH; THIN-FILM; CU SOLDER; SN; BALL; GROWTH; LAYER;

D O I：

10.1016/j.jallcom.2016.02.027

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

This study investigated the effect of massive spalling of intermetallic compounds (IMCs) on the microstructural evolution and mechanical properties of solder joints after multiple reflows. SAC305 solder was reflowed on substrates with four Co-based surface finishes: electroless Co (EC), electroless Co/immersion Au (ECIG), electroless Co/electroless Pd (ECEP), and electroless Co/electroless Pd/immersion Au (ECEPIG). CoSn3 was the main intermetallic compound (IMC) that formed in the systems, and it massively spalled in the systems with Pd and high P content. Systems with massive spalling have a high shear strength and low shear height owing to solid solution strengthening. Due to strain hardening, high shear velocity caused high strength in all systems. Massive spalling of CoSn3 transformed the failure mode from brittle to ductile and enhanced the shear strength of the joints. (C) 2016 Elsevier B.V. All rights reserved.

引用

页码：100 / 108

页数：9

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