A high-performance 14.4 to 19.7 GHz power detector fabricated with flip-chip technology

被引:0
作者
Zeeb, David M.
机构
来源
2006 European Microwave Conference, Vols 1-4 | 2006年
关键词
flip-chip devices; microwave detectors; microwave integrated circuits; MODFETs; passive circuits; Schottky diodes;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A rugged flip-chip technology with potential for low cost at high manufacturing volume was employed to fabricate a power detector using mixed device technologies. The circuit consists of one discrete GaAs pHEMT chip and one GaAs dual-Schottky-diode chip ffip-attached to a 3.5 mm by 2.1 mm substrate containing only passive circuitry. The power detector offers two different modes of operation to enable compensation for drift of the detector diode response over temperature.
引用
收藏
页码:1692 / 1695
页数:4
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STONEHAM EB, IN PRESS 2006 EUR MI