Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints

被引：146
作者：
Chen, Tiam Foo [1 ]
Siow, Kim Shyong [1 ]
机构：
[1] Univ Kebangsaan Malaysia, Inst Microengn & Nanoelect IMEN, Bangi, Malaysia
来源：
JOURNAL OF ALLOYS AND COMPOUNDS | 2021年 / 866卷
关键词：
Nanocrystalline materials; Grains and interfaces; Powder methods; Sintered silver; Lead-free; Die-attach materials; LOW-TEMPERATURE; DIE-ATTACH; NANOPARTICLE PASTE; SHEAR-STRENGTH; PARTICLE PASTE; NANOSILVER PASTE; BONDING STRENGTH; IN-SITU; POWER SEMICONDUCTOR; SURFACE-ROUGHNESS;
D O I：
10.1016/j.jallcom.2021.158783
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
This review compares the mechanical and thermal-electrical properties of sintered copper (Cu) with sintered silver (Ag) as bonding materials in the microelectronics joint applications. Sintered Cu is explored as a possible replacement for sintered Ag, which suffered from electrochemical migration and high cost. However, sintered Cu faces severe oxidation throughout its product lifecycle, from Cu particle synthesis to joint formation, and finally, post-sinter reliability testing. This review discusses the various sintering conditions and related metallization/treatments to control this Cu oxidation and microstructural evolutions to form a reliable joint (in mechanical-thermal-electrical properties) for as-sintered, thermal aged, and thermal-mechanical cycled conditions. Separately, the patent information showed that the sintered Cu's development and materials paste formulation followed those of sintered Ag closely and often claimed along as one of the sintered elements included in the patents. This review intends to guide new and experienced researchers to this sintered bonding to understand the sintering science, technologies, and related patents on sintered Cu and Ag. (C) 2021 Elsevier B.V. All rights reserved.
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页数：19
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