Ultra-Thin Chip Packaging (UTCP): a Promising Technology for Future Flexible Display Interconnection

被引：0
|
作者：
Govaerts, Jonathan [1 ]
Christiaens, Wim [1 ]
Vanfleteren, Jan [1 ]
机构：
[1] UGent ELIS, IMEC, Ctr Microsyst Technol Cmst, Ghent, Belgium
来源：
2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - III | 2009年
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D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
With several flexible display technologies sprouting up, the driving electronics seem to become the limiting factors in the bendability of any flexible display system. The idea of adapting existing interconnection technologies is discussed. Finally, ultrathin chip packaging is proposed to bypass this limitation imposed by the rigidity of the driver electronics.
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页码：202 / 205
页数：4
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