A Review of Vapor Chambers

被引：109
作者：
Bulut, Murat [1 ]
Kandlikar, Satish G. [2 ]
Sozbir, Nedim [1 ,3 ]
机构：
[1] Turksat Satellite Commun Cable TV & Operat Joint, Ankara, Turkey
[2] Rochester Inst Technol, Mech Engn Dept, Lomb Mem Dr, Rochester, NY 14623 USA
[3] Sakarya Univ, Mech Engn Dept, Sakarya, Turkey
来源：
HEAT TRANSFER ENGINEERING | 2019年 / 40卷 / 19期
关键词：
PLATE HEAT PIPES; THERMAL PERFORMANCE; WICK STRUCTURE; MULTI-ARTERY; RESISTANCE MEASUREMENT; DESIGN; VISUALIZATION; EVAPORATOR; TRANSPORT; GROOVES;
D O I：
10.1080/01457632.2018.1480868
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
Future developments in electronic industries will require efficient cooling systems to dissipate large amount of heat produced over a small area. In recent years, interest has grown in extending the use of vapor chambers to high heat flux electronics cooling because of their low thermal resistance values and uniform temperature distribution abilities. A detailed overview of vapor chambers is presented in this paper including their principle of operation, types of performance characteristics, and various applications. Recent developments in improving the thermal performance of vapor chambers are also presented in this article.
引用
收藏
页码：1551 / 1573
页数：23
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