A Review of Vapor Chambers

被引：103
作者：
Bulut, Murat [1 ]
Kandlikar, Satish G. [2 ]
Sozbir, Nedim [1 ,3 ]
机构：
[1] Turksat Satellite Commun Cable TV & Operat Joint, Ankara, Turkey
[2] Rochester Inst Technol, Mech Engn Dept, Lomb Mem Dr, Rochester, NY 14623 USA
[3] Sakarya Univ, Mech Engn Dept, Sakarya, Turkey
来源：
HEAT TRANSFER ENGINEERING | 2019年 / 40卷 / 19期
关键词：
PLATE HEAT PIPES; THERMAL PERFORMANCE; WICK STRUCTURE; MULTI-ARTERY; RESISTANCE MEASUREMENT; DESIGN; VISUALIZATION; EVAPORATOR; TRANSPORT; GROOVES;
D O I：
10.1080/01457632.2018.1480868
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
Future developments in electronic industries will require efficient cooling systems to dissipate large amount of heat produced over a small area. In recent years, interest has grown in extending the use of vapor chambers to high heat flux electronics cooling because of their low thermal resistance values and uniform temperature distribution abilities. A detailed overview of vapor chambers is presented in this paper including their principle of operation, types of performance characteristics, and various applications. Recent developments in improving the thermal performance of vapor chambers are also presented in this article.
引用
收藏
页码：1551 / 1573
页数：23
相关论文
共 103 条
  • [71] Experimental and theoretical study of a vapour chamber based heat spreader for avionics applications
    Reyes, M.
    Alonso, D.
    Arias, J. R.
    Velazquez, A.
    [J]. APPLIED THERMAL ENGINEERING, 2012, 37 : 51 - 59
  • [72] Thermal performance of flat-shaped heat pipes using nanofluids
    Shafahi, Maryam
    Bianco, Vincenzo
    Vafai, Kambiz
    Manca, Oronzio
    [J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2010, 53 (7-8) : 1438 - 1445
  • [73] The aluminum flat heat pipe using cyclopentane as working fluid
    Shimura, T
    Sho, H
    Nakamura, Y
    [J]. ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS, 2002, : 224 - 229
  • [74] Shukla K.N., 2015, J ELECT COOLING THER, V5, P1, DOI [10.4236/jectc.2015.51001, DOI 10.4236/JECTC.2015.51001]
  • [75] Transient thermal and hydrodynamic model of flat heat pipe for the cooling of electronics components
    Sonan, R.
    Harmand, S.
    Pelle, J.
    Leger, D.
    Fakes, M.
    [J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2008, 51 (25-26) : 6006 - 6017
  • [76] An asymmetrical vapor chamber with multiscale micro/nanostructured surfaces
    Sun, Zhen
    Qiu, Huihe
    [J]. INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 2014, 58 : 40 - 44
  • [77] A multi-artery vapor chamber and its performance
    Tang, Yong
    Yuan, Dong
    Lu, Longsheng
    Wang, Zhenyong
    [J]. APPLIED THERMAL ENGINEERING, 2013, 60 (1-2) : 15 - 23
  • [78] Experimental studies of thermal resistance in a vapor chamber heat spreader
    Tsai, Meng-Chang
    Kang, Shung-Wen
    de Paiva, Kleber Vieira
    [J]. APPLIED THERMAL ENGINEERING, 2013, 56 (1-2) : 38 - 44
  • [79] Two-phase closed thermosyphon vapor-chamber system for electronic cooling
    Tsai, Te-En
    Wu, Hsin-Hsuan
    Chang, Chih-Chung
    Chen, Sih-Li
    [J]. INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 2010, 37 (05) : 484 - 489
  • [80] Vadakkan U, 2005, P IEEE SEMICOND THER, P182
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