On-chip Differential-Transmission-Line(DTL) interconnect for 22nm technology

被引：0

作者：

Okada, Kenichi ^{[1
]}

Ito, Hiroyuki ^{[1
]}

Masu, Kazuya ^{[1
]}

机构：

[1] Tokyo Inst Technol, Integrated Res Inst, Midori Ku, Yokohama, Kanagawa 2268503, Japan

来源：

ADVANCED METALLIZATION CONFERENCE 2006 (AMC 2006) | 2007年

关键词：

D O I：

暂无

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

In this paper, we investigate on-chip interconnect technologies, and we propose Figure of Merit (FoM) to evaluate delay and power consumption of on-chip interconnects. RC, differential-transmission-line (DTL), carbon-nanotube (CNT), and optical interconnects are evaluated for 90 nm and 22 nm-technology nodes. The DTL interconnect has superior characteristics to the RC, CNT, and optical interconnections, and the DTL has the best FoM for more than 0.3-mm lines in 22 am technology.

引用

页码：29 / 33

页数：5

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