Integration of microstrip antenna on cavity-down ceramic ball grid array package

被引：27

作者：

Zhang, YP ^{[1
]}

机构：

[1] Nanyang Technol Univ, Sch Elect & Elect Engn, Singapore 639798, Singapore

来源：

ELECTRONICS LETTERS | 2002年 / 38卷 / 22期

关键词：

D O I：

10.1049/el:20020937

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The integration of a microstrip antenna on a thin 17 x 17 x 2 mm cavity-down ceramic ball grid array package is reported. The antenna, intended for use in either single-chip or single-package wireless transceivers, has achieved an impedance bandwidth of 1.25% and gain of 4.6 dBi at 5.15 GHz.

引用

页码：1307 / 1308

页数：2

共 3 条

[1] Chip-package codesign of a low-power 5-GHz RF front end [J].

Donnay, S ;

Pieters, P ;

Vaesen, K ;

Diels, W ;

Wambacq, P ;

De Raedt, W ;

Beyne, E ;

Engels, M ;

Bolsens, I .

PROCEEDINGS OF THE IEEE, 2000, 88 (10) :1583-1597

[2] A 5-GHz CMOS wireless LAN receiver front end [J].

Samavati, H ;

Rategh, HR ;

Lee, TH .

IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2000, 35 (05) :765-772

[3] Integration of microstrip patch antenna on ceramic ball grid array package [J].

Zhang, YP .

ELECTRONICS LETTERS, 2002, 38 (05) :207-208

← 1 →