Mode I stress intensity factors of printed and extruded specimens based on Digital Image Correlation method (DIC): case of ABS material

被引：7

作者：

Zekriti, Najat ^{[1
]}

Rhanim, Rajaa ^{[2
]}

Majid, Fatima ^{[1
]}

Lahlou, Mohammed ^{[3
]}

Ibrahim, Mrani ^{[1
]}

Rhanim, Hassan ^{[1
]}

机构：

[1] Univ Chouaib Doukkali, Lab Nucl Atom Mol Mech & Energet Phys, El Jadida, Morocco

[2] Univ Moulay Ismail, Lab Study Adv Mat & Applicat, Meknes, Morocco

[3] Univ Chouaib Doukkali, LabSIPE, ENSAJ, El Jadida, Morocco

来源：

1ST VIRTUAL EUROPEAN CONFERENCE ON FRACTURE - VECF1 | 2020年 / 28卷

关键词：

Crack growth; Stress intensity factor; ABS; Digital image correlation; 3D printing;

D O I：

10.1016/j.prostr.2020.10.149

中图分类号：

TU [建筑科学];

学科分类号：

0813 ;

摘要：

In the present paper, the Digital Image Correlation (DIC) method, which helps to find the stress intensity factors (SIF), is examined for the Single Edge Notch Tension (SENT) specimens under mode I loading for Acrylonitrile Butadiene Styrene (ABS) material for both extruded and printed samples. First, the analytical mode I stress, the displacement fields around the tip of the SENT specimen and the concept of SIF are explained. Then, the experimental setup for DIC method is performed and different loading speeds are considered over these specimens. Furthermore, the DIC method is employed to determine the experimental displacement fields around crack tips. Finally, the experimental displacement fields obtained through the DIC method and the analytical ones are leading to identify the same SIF. (C) 2020 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under responsibility of the European Structural Integrity Society (ESIS) ExCo

引用

页码：1745 / 1754

页数：10

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