共 60 条
- [53] WANG JL, 2008, J APPL PHYS, V104
- [54] Interfacial shear stress, peeling stress, and die cracking stress in trilayer electronic assemblies [J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2000, 23 (02): : 309 - 316
- [60] Interface reactions in the NiO-SDC-LSGM system [J]. SOLID STATE IONICS, 2000, 133 (3-4) : 153 - 160