IC technologies for mixed-signal and RF SiP

Specialty foundries are increasingly adopting advanced IC technologies in the mixed-signal system-in-package (SiP) and RF design approach for power amplifier modules. Specialty foundries are able to accelerate the adoption of mixed-signal/RF SiP by offering customized technologies made to analog and RF systems. The SiP approach offers an alternative to challenges involved with integrating analog and digital functions into an system-on-chip (SoC) design. Specialized IC technologies, expert user design tools, and customized assembly and packaging techniques are used to achieve the required system performance. The tools and techniques required for mixed-signal SiP design have improved to support high-volume manufacturing, including analog and mixed-signal products.