Geometrical integrity of micromold cavity sputtered by FIB using multilayer slicing approach

被引:3
作者
Ali, Mohammad Yeakub [1 ]
Loo, Yee Wei
机构
[1] Int Islamic Univ Malaysia, Fac Engn, Dept Mfg & Mat Engn, Kuala Lumpur 53100, Malaysia
[2] Nanyang Technol Univ, Sch Mech & Aerosp Engn, Precis Engn & Nanotechnol Ctr, Singapore 639798, Singapore
来源
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 2007年 / 13卷 / 01期
关键词
D O I
10.1007/s00542-006-0254-4
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper discusses the investigation of geometrical integrity of micromold cavity produced by focused ion beam (FIB) sputtering slice by slice. Parabolic shaped micromold cavity was chosen as an example. Preliminary experiments were carried out to characterize the machine and select the optimum process parameters such as beam current, pixel spacing, aperture size, and dwell time. The geometrical integrity of the sputtered micromold cavity was analyzed based on three selected criteria such as aspect ratio, cross-sectional area, and area offset. The theoretical and sputtered profiles were compared. The investigation showed that the measured aspect ratio was almost equal to the theoretical aspect ratio for low aspect ratio microcavity. For high aspect ratio cavity, the measured aspect ratio was higher than the theoretical aspect ratio by 5-8%. The area offset was found to be 5-10% of the theoretical area. The variation in theoretical and sputtered cross-sectional area was 2-4%. The characterization showed that the geometrical integrity of micromold cavity sputtered by FIB using slicing approach was high.
引用
收藏
页码:103 / 107
页数:5
相关论文
共 18 条
[1]   Microgrooving and microthreading tools for fabricating curvilinear features [J].
Adams, DP ;
Vasile, MJ ;
Krishnan, ASM .
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2000, 24 (04) :347-356
[2]   Fabricating micromilling tool using wire electrodischarge grinding and focused ion beam sputtering [J].
Ali, M. Y. ;
Ong, A. S. .
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2006, 31 (5-6) :501-508
[3]  
Friedrich C. R., 1996, Microsystem Technologies, V2, P144, DOI 10.1007/s005420050032
[4]   A variotherm mold for micro metal injection molding [J].
Fu, G ;
Loh, NH ;
Tor, SB ;
Tay, BY ;
Murakoshi, Y ;
Maeda, R .
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2005, 11 (12) :1267-1271
[5]   Fabrication of three-dimensional microstructures by two-dimensional slice by slice approaching via focused ion beam milling [J].
Fu, Y ;
Bryan, NKA .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2004, 22 (04) :1672-1678
[6]   Data format transferring for FIB microfabrication [J].
Fu, YQ ;
Bryan, NKA ;
San, OA ;
Hong, LB .
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2000, 16 (08) :600-602
[7]  
FU YQ, 2004, J MATER PROCESS TECH, V104, P44
[8]   DIGITAL SCAN MODEL FOR FOCUSED ION-BEAM-INDUCED GAS ETCHING [J].
HARRIOTT, LR .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1993, 11 (06) :2012-2015
[9]   Surface integrity and removal rate of silicon sputtered with focused ion beam [J].
Hung, NP ;
Ali, MY ;
Fu, YQ ;
Ong, NS ;
Tay, ML .
MACHINING SCIENCE AND TECHNOLOGY, 2001, 5 (02) :239-254
[10]   Study on the method for the reliability test of focused ion beam [J].
Lee, Sang H. ;
Kang, Hyun-Wook ;
Cho, Dong-Woo ;
Moon, Wonkyu .
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2007, 13 (5-6) :569-577