A Lossy Electromagnetic Bandgap Structure for Mode Suppression in Chip Scale Packages

被引：0

作者：

McKinzie, William E., III ^{[1
]}

机构：

[1] WEMTEC Inc, Fulton, MD 20759 USA

来源：

2015 IEEE COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT SYMPOSIUM (CSICS) | 2015年

关键词：

Chip scale packaging; parasitic mode suppression; electromagnetic bandgap; resistive film;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper introduces a novel concept for package mode suppression; a lossy electromagnetic bandgap (EBG) structure. It is comprised of an array of highly conductive metal vias connected to a patterned resistive film. These features may be formed inside the lid of a low temperature co-fired ceramic (LTCC) chip scale package (CSP) for broadband millimeter wave parasitic mode suppression. Full-wave simulations of an 8 mm square LTCC CSP are compared using two different lids; a simple metal lid versus an LTCC lid with an integrated lossy EBG structure. The package transitions are designed for 60 GHz operation, and a thru line is routed across the cavity floor and through an internal flip-chip die. End-to-end transmission coefficient and group delay are compared for the CSP with and without the lossy EBG structure. Simulated E field magnitude at sample points inside the package cavity are also compared for the two package lids. This new concept for cavity mode suppression is compatible with a low package height.

引用

页数：4

共 12 条

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[9] Nair D. M., 2013, 2013 IEEE INT MICR S, P1
[10] DAMPING OF THE RESONANT MODES OF A RECTANGULAR METAL PACKAGE
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