Ion beam generation from sheath field of grid electrode and its application to surface treatment

被引:10
作者
Cho, Yong-Sung
Lee, Hae June
Park, Chung-Hoo
Lee, Ho-Jun
Lee, Sung-Kwan
机构
[1] Korea Electrotechnol Res Inst, Elect Power Res Div, Chang Won 641600, South Korea
[2] Pusan Natl Univ, Dept Elect Engn, Pusan 609735, South Korea
[3] Korea Automat Co Ltd, Pusan 617041, South Korea
关键词
D O I
10.1063/1.2400390
中图分类号
O59 [应用物理学];
学科分类号
摘要
As plasma immersion ion implantation using a conducting grid is very useful to reduce the effect of capacitance and charging in surface modification, it is broadly applied in the fields of insulating material implantation. On the other hand, there have been only few attempts to analyze the sheath dynamics including the conducting grid. If the bias voltage applied to the conducting grid is in the range of hundreds of volts for sputtering, or the energy for local restructuring of the atomic arrangement is much lower than voltage for implantation, the surface charge and space charge substantially affect the incident ion energy and ion current to the surface. The formation of the space and surface charges during one bias pulse period are thus analyzed through a one-dimensional and a two-dimensional particle-in-cell simulation. Experiment with the optimally designed grid on the basis of the simulation results is conducted, and the results of both cases with grid and without grid are compared. The improvement of adhesion is yielded by increasing surface roughness and chemical change in the polyurethane treatment using the conducting grid. (c) 2006 American Institute of Physics.
引用
收藏
页数:5
相关论文
共 17 条
[1]   Pulse bias sputtering of copper onto insulating surfaces [J].
Barnat, EV ;
Lu, TM ;
Little, J .
JOURNAL OF APPLIED PHYSICS, 2001, 90 (10) :4946-4950
[2]   TEMPORAL EVOLUTION OF COLLISIONLESS SHEATHS [J].
CHO, MH ;
HERSHKOWITZ, N ;
INTRATOR, T .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1988, 6 (05) :2978-2986
[3]   Recent developments and applications of plasma immersion ion implantation [J].
Chu, PK .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2004, 22 (01) :289-296
[4]   MODEL FOR EXPANDING SHEATHS AND SURFACE CHARGING AT DIELECTRIC SURFACES DURING PLASMA SOURCE ION-IMPLANTATION [J].
EMMERT, GA .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1994, 12 (02) :880-883
[5]   Influence of thickness and dielectric properties on implantation efficacy in plasma immersion ion implantation of insulators [J].
Fu, RKY ;
Chu, PK ;
Tian, XB .
JOURNAL OF APPLIED PHYSICS, 2004, 95 (07) :3319-3323
[6]   Effects of mesh-assisted carbon plasma immersion ion implantation on the surface properties of insulating silicon carbide ceramics [J].
Fu, RKY ;
Fu, KL ;
Tian, XB ;
Chu, PK .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2004, 22 (02) :356-360
[7]   Enhancement of implantation energy using a conducting grid in plasma immersion ion implantation of dielectric/polymeric materials [J].
Fu, RKY ;
Tian, X ;
Chu, PK .
REVIEW OF SCIENTIFIC INSTRUMENTS, 2003, 74 (08) :3697-3700
[8]   The importance of bias pulse rise time for determining shallow implanted dose in plasma immersion ion implantation [J].
Kwok, DTK ;
Bilek, MMM ;
McKenzie, DR ;
Chu, PK .
APPLIED PHYSICS LETTERS, 2003, 82 (12) :1827-1829
[9]   PBII processing of dielectric layers: physical aspects limitations and experimental results [J].
Lacoste, A ;
Le Coeur, F ;
Arnal, Y ;
Pelletier, J ;
Grattepain, C .
SURFACE & COATINGS TECHNOLOGY, 2001, 135 (2-3) :268-273
[10]  
Lieberman MA, 2005, PRINCIPLES OF PLASMA DISCHARGES AND MATERIALS PROCESSING, 2ND EDITION, P1