Dimensionally stable solders for optoelectronics and microelectronics
被引:12
作者:
Mavoori, H
论文数: 0引用数: 0
h-index: 0
机构:
Bell Labs, Lucent Technol, Appl Mat & Met Res Grp, Murray Hill, NJ 07974 USABell Labs, Lucent Technol, Appl Mat & Met Res Grp, Murray Hill, NJ 07974 USA
Mavoori, H
[1
]
机构:
[1] Bell Labs, Lucent Technol, Appl Mat & Met Res Grp, Murray Hill, NJ 07974 USA
来源:
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY
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2000年
/
52卷
/
06期
关键词:
Solder Joint;
Solder Alloy;
Dimensional Stability;
Interfacial Bond Strength;
High Creep Resistance;