BSIM-IMG: Advanced Model for FDSOI Transistors with Back Channel Inversion

被引:7
作者
Agarwal, H. [1 ]
Kushwaha, P. [2 ]
Dasgupta, A. [2 ]
Y-Kao, M. [2 ]
Morshed, T. [3 ]
Workman, G. [3 ]
Shanbhag, K. [3 ]
Li, X. [3 ]
Vinothkumar, V. [3 ]
Chauhan, Y. S. [4 ]
Salahuddin, S. [1 ]
Hu, C. [1 ]
机构
[1] Indian Inst Technol Jodhpur, Karwar, India
[2] Univ Calif Berkeley, Berkeley, CA 94720 USA
[3] Globalfoundries Inc, Compact Modeling & Characterizat Div, Santa Clara, CA USA
[4] Indian Inst Technol Kanpur, Kanpur, Uttar Pradesh, India
来源
2020 IEEE ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM 2020) | 2020年
关键词
BSIM-IMG; FDSOI; back-side inversion; compact model;
D O I
10.1109/edtm47692.2020.9117979
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
FDSOI devices are prominently used in low power circuits and high frequency domains due to their superior RF and analog performance, thanks to back-bias capability and relatively ease of transistor design over FinFETs and planar bulk transistors. BSIM-IMG is the industry standard compact model for simulating FDSOI devices. In this work, we will discuss recent enhancements made in the BSIM-IMG model for accurate modeling of the FDSOI transistors. The back gate inversion is more physically modeled in the latest BSIM-IMG model. We will present a new 1/f noise model, which is validated with the experimental data. Improved output conductance, mobility and gate current models are also discussed. All the enhancements are done in such a way that benchmark RF figure of merit are met.
引用
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页数:4
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