High-Performance On-Chip Hot-Pressed NdFeB Hard Magnets for MEMS Applications

被引：3

作者：

He, Yifan ^{[1
]}

Yu, Chengju ^{[1
]}

Haidar, Samer ^{[2
]}

Zaeimbashi, Mohsen ^{[1
]}

Stephen, Gregory M. ^{[3
]}

Heiman, Don ^{[3
]}

Wei, Yuyi ^{[1
]}

Chen, Huaihao ^{[1
]}

Liang, Xianfeng ^{[1
]}

Dong, Cunzheng ^{[1
]}

Wang, Jiawei ^{[1
]}

Tu, Cheng ^{[4
]}

Zhang, Yi ^{[5
]}

Chen, Baoxing ^{[2
]}

Sun, Nian-Xiang ^{[1
]}

机构：

[1] Northeastern Univ, Dept Elect & Comp Engn, Boston, MA 02115 USA

[2] Analog Devices Inc, Wilmington, MA 01887 USA

[3] Northeastern Univ, Dept Phys, Boston, MA 02115 USA

[4] Univ Elect Sci & Technol China, Sch Elect Sci & Engn, Chengdu 611731, Peoples R China

[5] Sichuan Univ, Coll Elect & Informat Engn, Chengdu 610064, Peoples R China

来源：

IEEE TRANSACTIONS ON MAGNETICS | 2021年 / 57卷 / 04期

基金：

美国国家科学基金会;

关键词：

Bonded magnet; hot-pressing; neodymium iron boron (NdFeB); permanent magnet;

D O I：

10.1109/TMAG.2021.3057271

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In order to advance the potential of thick on-chip hard magnets for the micro-electro-mechanical system (MEMS), we investigate new silicon molding technique to fabricate dry-packed NdFeB magnets, including a silicon compression tool, which enables the pressing step during silicon-compatible processing. This process delivers samples with a remanence of 0.42 T and an energy product of 38 kJ/m(3). Further studies of metal molding show that, for wax-bonding powder-based NdFeB magnets, the optimum fabrication condition is 300 degrees C and 425 MPa, giving a remanence of 0.54 T and an energy product of 61.7 kJ/m(3).

引用

页数：4

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