Hybrid LCVD of micro-metallic lines for TFT-LCD circuit repair

被引:23
作者
Park, J. B.
Kim, C. J.
Shin, P. E.
Park, S. H.
Kang, H. S.
Jeong, S. H.
机构
[1] Gwangju Inst Sci & Technol, Dept Mechatron, Kwangju 500712, South Korea
[2] LG Prod Engn Res Ctr, Pyongtaek 451713, Kyunggido, South Korea
关键词
LCVD; circuit repair; LCD; micropatteming; laser application;
D O I
10.1016/j.apsusc.2006.06.054
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The deposition of micrometer-scale metallic lines by laser chemical vapor deposition (LCVD) on glass is investigated for the repair of open-circuit type defects of thin film transistor-liquid crystal display (TFT-LCD) panels. In this work, a third harmonic Nd:YLF laser (351 nm) of high repetition rates was used as the illumination source and W(CO)(6) was selected as the reaction material for the deposition of tungsten interconnects on glass substrate. General characteristics of the tungsten deposit such as height, width, morphology as well as electrical resistivity were examined for various process conditions. Height of the deposited tungsten lines ranged from 35 to 500 nm depending on laser power and scan speed while the width was controlled in the range of 3-50 mu m by adjusting the size of a slit placed in the beam path. The resistivity of deposited tungsten lines was measured to be below 1 Omega mu m. The tungsten deposit is considered to form through a hybrid process, namely through the combination of photolytic and pyrolytic mechanisms. The deposited tungsten lines developed in this study are successfully applied for the repair of TFr-LCD circuit defects without damaging the glass substrate. (c) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码:1029 / 1035
页数:7
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