Rate Dependence of Bending Fatigue Failure Characteristics of Lead-Free Solder Joint

被引：4

作者：

Bang, Woong Ho ^{[1
]}

Chen, Liang-Shan ^{[1
]}

Kim, Choong-Un ^{[1
]}

Lee, Tae-Kyu ^{[2
]}

Liu, Kuo-Chuan ^{[2
]}

机构：

[1] Univ Texas Arlington, Dept Mat Sci & Engn, 500 W 1st St,Box 19031, Arlington, TX 76019 USA

[2] Cisco Syst Inc, Interconnect Technol Team, San Jose, CA 95134 USA

来源：

2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4 | 2009年

关键词：

D O I：

10.1109/ECTC.2009.5074309

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

This study concerns the failure mechanism of a lead-free SAC305 solder joint under the isothermal bending fatigue condition. For this, series of bending fatigue tests are carried out with the variations of bending displacement and frequency, and FEM analysis is conducted to examine the relationship between mechanical behavior of a solder joint and fatigue life cycle. The results of this investigation suggest that the isothermal fatigue of a solder joint is strongly affected by plastic deformation process of SAC solder. It is found that the failure life cycle 'N-f' fits well to the model suggested by Coffin-Manson, that is N-f similar to (Delta epsilon(p))(-2.3). This result indicates that fatigue failure is determined by accumulation of damage by plastic deformation of solder. The fractography of a solder joint also supports our conclusion because crack is found to propagate along the solder matrix near to IMC interface.

引用

页码：2070 / +

页数：2

共 8 条

[1]

Coffin Jr LF, 1954, T AM SOC MECH ENG, V76, P931

[2] Effect of simulation methodology on solder joint crack growth correlation [J].

Darveaux, R .

50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, :1048-1058

[3] Design for lead-free solder joint reliability of high-density packages [J].

Lau, J ;

Dauksher, W ;

Smetana, J ;

Horsley, R ;

Shangguan, D ;

Castello, T ;

Menis, I ;

Love, D ;

Sullivan, B .

SOLDERING & SURFACE MOUNT TECHNOLOGY, 2004, 16 (01) :12-26

[4]

Manson S.S, 1953, National Advisory Committee for Aeronautics

[5]

Perkins AE, 2009, SOLDER JOINT RELIABILITY PREDICTION FOR MULTIPLE ENVIRONMENTS, P39

[6]

Ridout S, 2007, FATIGUE FRACT ENG M, V30, P400, DOI 10.1111/j.1460.2695.2006.01065.x

[7] Mechanical bending fatigue reliability and its application to area array packaging [J].

Skipor, A ;

Leicht, L .

51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, :606-612

[8] Time-independent mechanical and physical properties of the ternary 95.5Sn-3.9Ag-0.6Cu solder [J].

Vianco, PT ;

Rejent, JA ;

Kilgo, AC .

JOURNAL OF ELECTRONIC MATERIALS, 2003, 32 (03) :142-151

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