Development of a new method to estimate thermal performance of multilayer radiant floor

被引:17
作者
Li, Qingqing [1 ,2 ]
Zhang, Ye [3 ]
Guo, Tieming [1 ]
Fan, Jianhua [2 ]
机构
[1] Qingdao Agr Univ, Sch Civil Engn & Architecture, Qingdao 266000, Peoples R China
[2] Tech Univ Denmark, Dept Civil Engn, Lyngby, Denmark
[3] Jiaxing Univ, Coll Architecture & Civil Engn, Jiaxing 314001, Zhejiang, Peoples R China
基金
中国国家自然科学基金; 浙江省自然科学基金;
关键词
Thermal performance; Radiant floor; Analytical solution; Temperature distribution; Thermal resistance;
D O I
10.1016/j.jobe.2020.101562
中图分类号
TU [建筑科学];
学科分类号
0813 ;
摘要
For a pipe-embedded concrete radiant floor, its thermal performance is essential to maintain the desired cooling/heating capacity and indoor thermal comfort. A good temperature distribution of the floor surface is very important in order to prevent occupant discomfort and avoid possible condensation in the case of floor cooling. In this study, a heat transfer model of a three-layer floor was developed by coupling 2-D and 1-D heat transfer problems. The analytical solution was developed and validated. The results of the calculations are in a good agreement with the experiments. The absolute error between the calculated and the measured floor surface temperatures was within 0.4.. The maximum relative error was within 2.2%. The proposed method can be utilized to calculate the thermal performance of a floor, either a one-layer floor, a two-layer floor or a three-layer floor. The thermal resistance of the floor with different structures can be calculated and used to estimate thermal performance of the floor. For the typical radiant floor, the range of thermal resistance is approximately 0.15-0.45 m(2)K/W with a pipe spacing from 0.1 to 0.5 m. With the overall floor temperature obtained, it is possible to identify the percentage of the floor area with a temperature higher than the limit and to estimate the overall and local occupant comfort. Based on the thermal resistance of the floor, an e-NTU method will be developed in the future study for design of a radiant floor.
引用
收藏
页数:11
相关论文
共 28 条
  • [1] [Anonymous], 1958, COMPACT HEAT EXCHANG
  • [2] [Anonymous], 2012, 1185512012E ISO
  • [3] B. EN, 2008, HEATING COOLING SURF
  • [4] Bean R, 2010, ASHRAE J, V52, P40
  • [5] Bean R, 2010, ASHRAE J, V52, P50
  • [6] Transient three-dimensional heat conduction problems with partial heating
    Beck, James V.
    [J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2011, 54 (11-12) : 2479 - 2489
  • [7] Transient simulation of a storage floor with a heating/cooling parallel pipe system
    Flores Larsen, Silvana
    Filippin, Celina
    Lesino, Graciela
    [J]. BUILDING SIMULATION, 2010, 3 (02) : 105 - 115
  • [8] Steady-state heat conduction in multi-layer bodies
    Haji-Sheikh, A
    Beck, JV
    Agonafer, D
    [J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2003, 46 (13) : 2363 - 2379
  • [9] Uneven gridding of thermal nodal networks in floor heating simulations
    Holopainen, R.
    Tuomaala, P.
    Piippo, J.
    [J]. ENERGY AND BUILDINGS, 2007, 39 (10) : 1107 - 1114
  • [10] A review of the application of radiant cooling & heating systems in Mainland China
    Hu, R.
    Niu, J. L.
    [J]. ENERGY AND BUILDINGS, 2012, 52 : 11 - 19