Electroluminescence Microscopy of Cross-Sectioned AlGaN/GaN High-Electron Mobility Transistors

被引:7
作者
Hilton, Albert M. [1 ]
Heller, Eric R. [2 ]
Dorsey, Donald L. [2 ]
机构
[1] Wyle Aerosp Grp, Dayton, OH 45431 USA
[2] US Air Force, Mat Mfg Directorate, Res Lab, Wright Patterson AFB, OH 45433 USA
关键词
AlGaN; electrical stress; electroluminescence (EL); GaN device modeling; high-electron mobility transistor (HEMT); hot electrons; reliability; RELIABILITY; TEMPERATURE; DEGRADATION; HEMT; GAN; TRANSPORT; TRAPS;
D O I
10.1109/TED.2016.2532475
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We report an electroluminescence (EL) microscopy study of operating cross-sectioned AlGaN/GaN high-electron mobility transistors. By examining devices in a cross-sectional view, the distribution and intensity of photons emitted from underneath the optically opaque metal of the gate and drain structures can be studied. The location and the shape of EL bright spots were quantitatively compared with simulated device behavior, revealing a strong correlation between the measured EL intensity and the expected distribution of hot electrons in the channel. Under constant low-power conditions, the bulk of the EL signal migrates from the drain edge of the gate field plate to the drain edge of the source-connected field plate (SCFP) as the drain bias is increased. Hot electrons have been cited as a dominant contributor to device degradation for some devices, so quantifying their location and bias dependence is critical to understanding how this degradation rate might scale with bias and device design. In addition, devices both with and without an SCFP were imaged to quantitatively investigate the influence of the field plate on the EL signal. Finally, a measurement of the spectra of EL signals is used to estimate the temperature of hot electrons in the device.
引用
收藏
页码:1459 / 1463
页数:5
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