共 50 条
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Numerical predictions of 3D power-supply on chip taking into considerations of proximity effect
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2021 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC),
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A detailed analysis of power-supply noise attenuation in bandgap voltage references
[J].
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-FUNDAMENTAL THEORY AND APPLICATIONS,
2003, 50 (02)
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Investigation of Horizontally Aligned Carbon Nanotubes for Efficient Power Delivery in 3D ICs
[J].
2014 IEEE 18TH WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI),
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Four-tier Monolithic 3D ICs: Tier Partitioning Methodology and Power Benefit Study
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ISLPED '16: PROCEEDINGS OF THE 2016 INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN,
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Design Automation and Testing of Monolithic 3D ICs: Opportunities, Challenges, and Solutions
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2017 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD),
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System-Level Comparison of Power Delivery Design for 2D and 3D ICs
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2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION,
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Analysis of jitter due to power-supply noise in phase-locked loops
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PROCEEDINGS OF THE IEEE 2000 CUSTOM INTEGRATED CIRCUITS CONFERENCE,
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Analysis of the Impact of Power Distribution on the Efficiency of Microchannel Cooling in 3D ICs
[J].
2016 22ND INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC),
2016,
:90-95