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- [1] Power-Supply Noise Analysis for Monolithic 3D ICs Using Electrical and Thermal Co-Simulation 2018 25TH IEEE INTERNATIONAL CONFERENCE ON ELECTRONICS, CIRCUITS AND SYSTEMS (ICECS), 2018, : 217 - 220
- [2] Design of a Reliable Power Delivery Network for Monolithic 3D ICs PROCEEDINGS OF THE 2020 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION (DATE 2020), 2020, : 1746 - 1751
- [3] Frequency and Time Domain Analysis of Power Delivery Network for Monolithic 3D ICs 2017 IEEE/ACM INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN (ISLPED), 2017,
- [5] Power Supply Noise-Aware Scan Test Pattern Reshaping for At-Speed Delay Fault Testing of Monolithic 3D ICs 2020 IEEE 29TH ASIAN TEST SYMPOSIUM (ATS), 2020, : 162 - 167
- [6] Power-Delivery Network in 3D ICs: Monolithic 3D vs. Skybridge 3D CMOS PROCEEDINGS OF THE IEEE/ACM INTERNATIONAL SYMPOSIUM ON NANOSCALE ARCHITECTURES (NANOARCH 2017), 2017, : 73 - 78
- [8] Full Chip Impact Study of Power Delivery Network Designs in Monolithic 3D ICs 2014 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD), 2014, : 565 - 572
- [9] Integrated Power Delivery Methodology for 3D ICs PROCEEDINGS OF THE TWENTY THIRD INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED 2022), 2022, : 114 - 119
- [10] Power, Performance, and Cost Comparisons of Monolithic 3D ICs and TSV-based 3D ICs 2015 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S), 2015,