Measurement and analysis of BGA defects with advanced x-ray inspection systems

被引：0

作者：

Amtower, R ^{[1
]}

机构：

[1] CR Technol Inc, Laguna Niguel, CA 92607 USA

来源：

SMTA INTERNATIONAL PROCEEDINGS OF THE TECHNICAL PROGRAM | 1999年

关键词：

X-Ray; BGA; voiding; solder joints;

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Real-time x-ray inspection is an essential tool for process and quality control of the assembly of EGA devices on printed circuit boards. The key factors in selecting an x-ray system are resolution, magnification and image quality, integrated with image processing and analytical tools. As EGA device technology has evolved, the requirements for x-ray inspection systems have increased significantly. This article describes x-ray system performance features and the requirements for inspection capability, emphasizing process-critical measurements such as voiding. The advantages of geometric magnification, rotation for angled viewing, and high resolution are essential as solder bump sizes shrink and bump density increases. Accurate and repeatable tools for measuring and recording EGA defect data are critical to understanding and controlling process parameters.

引用

页码：497 / 503

页数：7