On Neural Networks Based Electrothermal Modeling of GaN Devices
被引:33
作者:
Jarndal, Anwar
论文数: 0引用数: 0
h-index: 0
机构:
Univ Sharjah, Elect & Comp Engn Dept, Sharjah 27272, U Arab EmiratesUniv Sharjah, Elect & Comp Engn Dept, Sharjah 27272, U Arab Emirates
Jarndal, Anwar
[1
]
机构:
[1] Univ Sharjah, Elect & Comp Engn Dept, Sharjah 27272, U Arab Emirates
来源:
IEEE ACCESS
|
2019年
/
7卷
关键词:
GaN HEMT;
electrothermal modeling;
neural networks;
genetic algorithm optimization;
ALGAN/GAN HEMTS;
LOCAL MINIMA;
BACKPROPAGATION;
DISPERSION;
D O I:
10.1109/ACCESS.2019.2928392
中图分类号:
TP [自动化技术、计算机技术];
学科分类号:
0812 ;
摘要:
This paper presents an effcient artificial neural network (ANN) electrothermal modeling approach applied to GaN devices. The proposed method is based on decomposing the device nonlinearity into intrinsic trapping-induced and thermal-induced nonlinearities that can be simulated by low-order ANN models. The ANN models are then interconnected in the physics-relevant equivalent circuit to accurately simulate the transistor. Genetic algorithm (GA)-based training procedure has been implemented to find optimal values for the weights of the ANN models. The modeling approach is used to develop a large-signal model for a 1-mm gate-width GaN high-electron mobility transistor (HMET). The model has been implemented in the advanced design system (ADS) and it has been validated by pulsed and continues small- and large-signal measurements. The model simulations showed a very good agreement with the measurements and verify the validity of the developed technique for dynamic electrothermal modeling of active devices.