High breakdown voltage characteristics in normally-off 4H-SiC VJFET using TCAD Simulation

被引:0
作者
Khalid, Muhammad [1 ]
Riaz, Saira [2 ]
Grekov, Alexandrov E. [3 ]
Santi, Enrico [3 ]
Naseem, Shahzad [2 ]
机构
[1] NED Univ Engn & Technol, Dept Phys, Karachi 75270, Pakistan
[2] Univ Punjab, Sch Phys Sci, Ctr Excellence Solid State Phys, Microelect Div, Lahore 54590, Pakistan
[3] Univ S Carolina, Dept Elect Engn, Columbia, SC 29208 USA
关键词
Breakdown voltage; channel width; electric field; impact ionization; temperature; VERTICAL-CHANNEL-JFETS; RELIABILITY;
D O I
10.1016/j.matpr.2015.11.065
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The high temperature dependent breakdown voltages in normally-off 4H-SiC VJFET are simulated using Sentaurus TCAD at different temperatures ranging from 27 to 500 degrees C. Temperature dependent breakdown voltages simulations reveal the decrement in breakdown voltages with increasing temperature, and device exhibits negative temperature coefficient. In addition, breakdown voltages are straight forwardly linked with associated parameters like impact ionization, which is strongly dependant on electric field. The improved breakdown voltage of 14 kV (drain leakage current 10(-8) A) indicates relatively high electric field of 2.2 MV/cm. In addition, its high breakdown capability and low leakage current with adjustable channel width make 4H-SiC VJFET a desirable device for high voltage power applications. (C) 2015 Published by Elsevier Ltd.
引用
收藏
页码:5436 / 5440
页数:5
相关论文
共 9 条
[1]   Demonstration of first 10kV, 130 mΩcm2 normally-off 4H-SiC trenched-and-implanted vertical junction field-effect transistor [J].
Alexandrov, P ;
Zhang, J ;
Li, X ;
Zhao, JH .
ELECTRONICS LETTERS, 2003, 39 (25) :1860-1861
[2]   Toward SiC-JFETs modelling with temperature dependence [J].
Ben Salah, T. ;
Morel, H. ;
Mtimet, S. .
EUROPEAN PHYSICAL JOURNAL-APPLIED PHYSICS, 2010, 52 (02)
[3]   High-Temperature Static and Dynamic Reliability Study of 4H-SiC Vertical-Channel JFETs for High-Power System Applications [J].
Cheng, L. ;
Martin, P. ;
Mazzola, M. S. ;
Sheridan, D. C. ;
Kelly, R. L. ;
Bondarenko, V. ;
Morrison, S. ;
Gray, R. ;
Tian, G. ;
Scofield, J. D. ;
Casady, J. R. B. ;
Casady, J. B. .
SILICON CARBIDE AND RELATED MATERIALS 2007, PTS 1 AND 2, 2009, 600-603 :1051-+
[4]   Measurements of impact ionization coefficients of electrons and holes in 4H-SiC and their application to device simulation [J].
Hatakeyama, Tetsuo .
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2009, 206 (10) :2284-2294
[5]   Remarkable increase in the channel mobility of SiC-MOSFETs by controlling the interfacial SiO2 layer between Al2O3 and SiC [J].
Hatayama, Tomohiro ;
Hino, Shiro ;
Miura, Naruhisa ;
Oomori, Tatsuo ;
Tokumitsu, Eisuke .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2008, 55 (08) :2041-2045
[6]  
Li X, 2004, MATER SCI FORUM, V457-460, P1197
[7]   Reliability and performance limitations in SiC power devices [J].
Singh, R .
MICROELECTRONICS RELIABILITY, 2006, 46 (5-6) :713-730
[8]   A 9-kV Normally-ON Vertical-Channel SiC JFET for Unipolar Operation [J].
Veliadis, V. ;
Stewart, E. J. ;
Hearne, H. ;
Snook, M. ;
Lelis, A. ;
Scozzie, C. .
IEEE ELECTRON DEVICE LETTERS, 2010, 31 (05) :470-472
[9]   1200 V SiC vertical-channel-JFETs and cascode switches [J].
Veliadis, Victor .
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2009, 206 (10) :2346-2362