Thick-film-on-steel resistors prove worthy to high-temperature, high-power applications

被引:0
|
作者
Morrison, D
机构
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:34 / 35
页数:2
相关论文
共 50 条
  • [2] Thick film resistors for high power and current sensing applications
    Nabatian, DJ
    Brown, OW
    Durant, JE
    1999 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 1999, 3906 : 124 - 130
  • [3] High-temperature anomalies in resistivity and thermoelectric power of thick-film resistors and their conduction mechanism
    Abdurakhmanov, G
    Abdurakhmanova, NG
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2005, 202 (09): : 1799 - 1803
  • [4] High-temperature storage and thermal cycling studies of thick film and wirewound resistors
    Naefe, JE
    Johnson, RW
    Grzybowski, RR
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2002, 25 (01): : 45 - 52
  • [5] GaN MESFETs for high-power and high-temperature microwave applications
    Myong Ji Univ, Kyunggi-do, Korea, Republic of
    Electron Lett, 6 (498-500):
  • [6] GAN MESFETS FOR HIGH-POWER AND HIGH-TEMPERATURE MICROWAVE APPLICATIONS
    SHIN, MW
    TREW, RJ
    ELECTRONICS LETTERS, 1995, 31 (06) : 498 - 500
  • [7] High-temperature thick Al wire bonding technology for high-power modules
    Komiyama, T
    Chonan, Y
    Onuki, J
    Koizumi, M
    Shigemura, T
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2002, 41 (08): : 5030 - 5033
  • [8] High-temperature thick Al wire bonding technology for high-power modules
    Komiyama, Takao
    Chonan, Yasunori
    Onuki, Jin
    Koizumi, Masahiko
    Shigemura, Tatsuya
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 2002, 41 (08): : 5030 - 5033
  • [9] HIGH-POWER DENSITY THIN-FILM RESISTORS
    FAITH, TJ
    IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1975, 11 (04): : 273 - 281
  • [10] Silicon Carbide (SiC) Antennas for High-Temperature and High-Power Applications
    Karacolak, Tutku
    Thirumalai, Rooban Venkatesh K. G.
    Merrett, J. Neil
    Koshka, Yaroslav
    Topsakal, Erdem
    IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS, 2013, 12 : 409 - 412