Intriguing conducting properties of HfOxNy thin films prepared from the Hf[N(C2H5)2]4

被引:15
作者
Chou, Yi-Hsuan [1 ]
Chiu, Hsin-Tien
Kuo, Teng-Fang
Chi, Cheng-Chung
Chuang, Shiow-Huey
机构
[1] Natl Chiao Tung Univ, Dept Appl Chem, Hsinchu 300, Taiwan
[2] Natl Tsing Hua Univ, Dept Phys, Hsinchu 300, Taiwan
[3] Natl Univ Kaohsiung, Dept Appl Chem, Kaohsiung 811, Taiwan
关键词
D O I
10.1063/1.2405848
中图分类号
O59 [应用物理学];
学科分类号
摘要
Hafnium nitride films were prepared on the Si(100) substrates by the metal-organic chemical vapor deposition method using Hf[N(C2H5)(2)](4). The prepared samples were then oxidized in air, followed by rapid-thermal annealing to produce HfOxNy thin films, meanwhile the associated physical properties were investigated. The x-ray photoelectron spectroscope analysis unveiled that the composition of the films is HfOxNy. In addition, the films after the rapid-thermal annealing treatments at various temperatures revealed salient features in their physical properties, such as capacitance and conductivity. On this basis, the feasibility of using the HfOxNy layers as high-k dielectrics in complementary metal oxide semiconductor transistors was also discussed. (c) 2006 American Institute of Physics.
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页数:3
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共 18 条
[1]   In-situ heteroepitaxial growth of CeO2/YBa2Cu3O7 films on sapphire by injection CVD [J].
Abrutis, A ;
Kubilius, V ;
Bigelyte, V ;
Teiserskis, A ;
Saltyte, Z ;
Senateur, JP ;
Weiss, F .
MATERIALS LETTERS, 1997, 31 (3-6) :201-207
[2]  
Cho MH, 2005, APPL PHYS LETT, V87, DOI [10.1063/1.2143132, 10.1063/1.2143432]
[3]   Electrical properties and thermal stability of CVD HfOxNy gate dielectric with poly-Si gate electrode [J].
Choi, CH ;
Jeon, TS ;
Clark, R ;
Kwong, DL .
IEEE ELECTRON DEVICE LETTERS, 2003, 24 (04) :215-217
[4]  
GILLISPIE CC, 1981, DICT SCI BIOGRAPHY, V4, P189
[5]   HIGH DIELECTRIC-CONSTANT OF RF-SPUTTERED HFO2 THIN-FILMS [J].
HSU, CT ;
SU, YK ;
YOKOYAMA, M .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 1992, 31 (08) :2501-2504
[6]   The electrical and material characterization of hafnium oxynitride gate dielectrics with TaN-Gate electrode [J].
Kang, CS ;
Cho, HJ ;
Choi, R ;
Kim, YH ;
Kang, CY ;
Rhee, SJ ;
Choi, CW ;
Akbar, MS ;
Lee, JC .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2004, 51 (02) :220-227
[7]   Thermal stability of nitrogen incorporated in HfNxOy gate dielectrics prepared by reactive sputtering [J].
Kang, JF ;
Yu, HY ;
Ren, C ;
Li, MF ;
Chan, DSH ;
Hu, H ;
Lim, HF ;
Wang, WD ;
Gui, D ;
Kwong, DL .
APPLIED PHYSICS LETTERS, 2004, 84 (09) :1588-1590
[8]   Thermal stability and electrical characteristics of ultrathin hafnium oxide gate dielectric reoxidized with rapid thermal annealing [J].
Lee, BH ;
Kang, LG ;
Nieh, R ;
Qi, WJ ;
Lee, JC .
APPLIED PHYSICS LETTERS, 2000, 76 (14) :1926-1928
[9]   Interfacial growth in HfOxNy gate dielectrics deposited using [(C2H5)2N]4Hf with O2 and NO [J].
Lee, M ;
Lu, ZH ;
Ng, WT ;
Landheer, D ;
Wu, X ;
Moisa, S .
APPLIED PHYSICS LETTERS, 2003, 83 (13) :2638-2640
[10]   Group IVB metal oxides high permittivity gate insulators deposited from anhydrous metal nitrates [J].
Ma, TZ ;
Campbell, SA ;
Smith, R ;
Hoilien, N ;
He, BY ;
Gladfelter, WL ;
Hobbs, C ;
Buchanan, D ;
Taylor, C ;
Gribelyuk, M ;
Tiner, M ;
Coppel, M ;
Lee, JJ .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2001, 48 (10) :2348-2356