A Bias-Dependent Single-Event Compact Model Implemented Into BSIM4 and a 90 nm CMOS Process Design Kit

被引:119
作者
Kauppila, Jeffrey S. [1 ]
Sternberg, Andrew L. [1 ]
Alles, Michael L. [1 ]
Francis, A. Matt [2 ]
Holmes, Jim [2 ]
Amusan, Oluwole A. [3 ]
Massengill, Lloyd W. [1 ,4 ]
机构
[1] Vanderbilt Univ, Inst Space & Def Elect, Nashville, TN 37203 USA
[2] Lynguent Inc, Fayetteville, AR 72701 USA
[3] Vanderbilt Univ, Dept Elect Engn & Comp Sci, Nashville, TN 37235 USA
[4] Vanderbilt Univ, Dept Elect Engn & Comp Sci, Nashville, TN 37203 USA
关键词
Integrated circuit radiation effects; MOSFETs; single-event effects; SPICE;
D O I
10.1109/TNS.2009.2033798
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A single-event model capable of capturing bias-dependent effects has been developed and integrated into the BSIM4 transistor model and a 90 nm CMOS process design kit. Simulation comparisons with mixed mode TCAD are presented.
引用
收藏
页码:3152 / 3157
页数:6
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